Active Ester Resin Composition for Low Dielectric Loss and Heat Resistance
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Solution Overview
Problem
Current thermosetting resin compositions face challenges in achieving both excellent heat resistance and flame retardancy while maintaining a low dielectric constant and low dielectric loss tangent, particularly in high-frequency and high-speed electronic applications, where existing active ester compounds compromise on heat resistance and flame retardancy due to their molecular structures.
Innovation Solution
A thermosetting resin composition utilizing a polyaryleneoxy structure with an active ester resin, produced by reacting a phenolic hydroxyl group-containing resin with monofunctional aromatic carboxylic acids or their chlorides and aromatic dicarboxylic acids, maintaining phenolic hydroxyl groups and incorporating benzoyl groups, to enhance heat resistance and flame retardancy while maintaining low dielectric properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If active ester compounds produced by aryl-esterifying phenolic hydroxyl groups in phenol novolac resins are used as curing agents, then dielectric characteristics (low dielectric constant and low dielectric loss tangent) are improved, but heat resistance deteriorates due to decreased crosslinking density
Solution Approach 1:
The invention changes the chemical structure parameters of the active ester compound by introducing a specific structural formula (I) with controlled parameters: n=1-3, p=0-2, and q=0-3. This structural parameter optimization allows achieving both low dielectric loss tangent and satisfactory heat resistance by balancing the aromatic hydrocarbon groups for dielectric performance with sufficient crosslinking capability for heat resistance
Solution Approach 2:
The invention creates a composite curing system by combining the specifically structured active ester compound (I) with epoxy resin, forming a composite material system that achieves synergistic effects. The composite structure allows the aromatic hydrocarbon groups to provide low dielectric properties while the epoxy-active ester crosslinking network provides heat resistance
2Measurement precision
If active ester compounds produced by aryl-esterifying phenolic hydroxyl groups in phenol novolac resins are used, then dielectric characteristics are improved, but flame retardancy deteriorates due to combustible pendant-like aromatic hydrocarbon groups
Solution Approach 1:
The invention optimizes the parameters of aromatic hydrocarbon groups in structure (I) by controlling substitution patterns (p and q values) and chain length (n value). This parameter optimization reduces the pendant-like aromatic hydrocarbon content that causes combustion while maintaining the low dielectric loss tangent property. The controlled structure limits excessive aromatic groups that would compromise flame retardancy
Solution Approach 2:
The invention applies local quality by strategically placing aromatic hydrocarbon groups in specific positions within the molecular structure (as defined by parameters p and q in formula I). This localized arrangement ensures aromatic groups contribute to dielectric performance at specific sites while minimizing their overall combustion-promoting effect, achieving local optimization of both dielectric and flame retardant properties
3Temperature
If crosslinking density is increased to improve heat resistance, then flame retardancy may be compromised due to the molecular structure of existing active ester compounds
Solution Approach 1:
The invention changes the molecular structure parameters of the active ester compound to achieve optimal crosslinking density. By adjusting parameters n, p, and q in structure (I), the invention achieves sufficient crosslinking for heat resistance while controlling the amount and arrangement of aromatic hydrocarbon groups to maintain flame retardancy. The parameter optimization ensures crosslinking without excessive combustible groups
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent heat resistance, flame retardancy, and low dielectric characteristics, suitable for high-frequency applications without using halogen-based flame retardants, ensuring effective performance in semiconductor encapsulating materials and circuit boards.
Implementation Method 1
reacting a phenolic hydroxyl group-containing resin with a monofunctional aromatic carboxylic acid or its chloride so as to leave phenolic hydroxyl groups in the resin, and then reacting the reaction product with an aromatic dicarboxylic acid or aromatic dicarboxylic acid chloride
Data Source
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AI summary
The present invention provides a thermosetting resin composition exhibiting excellent heat resistance and flame retardancy while maintaining a low dielectric constant and low dielectric loss tangent when formed into a cured product, a cured product thereof, an active ester resin which develops these properties, and a semiconductor encapsulating material, a prepreg, a circuit board, and a build-up film which are produced using the composition. A thermosetting resin composition contains an active ester resin (A) and an epoxy resin (B) as essential components, the active ester resin (A) having a resin structure which includes a polyaryleneoxy structure (I) and in which aromatic carbon atoms in a plurality of the polyaryleneoxy structures (I) are linked through a structural site (II) represented by a structural formula 1 (wherein Ar represents a phenylene group, a phenylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms, a naphthylene group, or a naphthylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms).