Active Heat-Dissipation System for Base Station Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat-dissipation methods for base stations, especially those in narrow and enclosed spaces, are inefficient due to the mixing of cold air with surrounding air, leading to ineffective cooling of high-efficiency chips and electronic elements.
Innovation Solution
An active heat-dissipation system comprising a controller, power module, and heat-dissipation module that uses adaptive fuzzy control or wavelet neural network algorithms to optimize temperature control, incorporating a cooling chip, variable fan, heat pipe, and vapor chamber for enhanced heat exchange and air flow, ensuring rapid temperature convergence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat-dissipation methods use air conditioners to cool down surrounding temperature and guide cold air through natural or forced convection, then the base station environment can be cooled, but the cold air mixes with surrounding air before reaching heat sources, reducing cooling effectiveness
Solution Approach 1:
The patent extracts the cold air directly from the air conditioner's exhaust outlet and delivers it directly to the heat sources (chips and electronic elements) without allowing it to mix with the surrounding air. This is achieved by positioning heat-dissipation modules at the exhaust outlet and using directed airflow paths to transport the coldest air directly to where it is needed most.
Solution Approach 2:
The patent introduces heat-dissipation modules (including fans, heat pipes, and vapor chambers) as intermediaries between the air conditioner's cold air exhaust and the heat sources. These modules actively transport and direct the cold air, ensuring it reaches the chips and electronic elements without mixing with warmer surrounding air, thereby maintaining cooling effectiveness.
2Productivity
If high-efficiency chips and electronic elements are placed in narrow and enclosed spaces to improve base station efficiency and minimize size, then space utilization is improved, but heat dissipation becomes difficult due to poor air flow
Solution Approach 1:
The patent segments the heat-dissipation function into multiple distributed modules placed throughout the narrow and enclosed space. Each heat-dissipation module includes local fans, heat pipes, and vapor chambers that independently manage heat removal from specific chips and electronic elements, enabling effective cooling despite the confined space constraints.
Solution Approach 2:
The patent employs heat pipes and vapor chambers that utilize phase change and capillary action to transfer heat in three dimensions, not just through air convection. This allows heat to be moved from chips to heat-dissipation modules through condensed phases, overcoming the limitations of narrow spatial constraints and enabling effective heat removal from densely packed components.
3Ease of operation
If cold air is exhausted by air conditioner and then mixed with surrounding air before heat-dissipation, then the cooling process is simplified, but the coldest air cannot be effectively utilized for cooling heat sources
Solution Approach 1:
The patent performs preliminary action by positioning heat-dissipation modules directly at the air conditioner's exhaust outlet, where the coldest air is available. The modules immediately capture and direct this cold air to heat sources before any mixing with surrounding air can occur, preserving the maximum temperature differential for effective cooling.
Solution Approach 2:
The patent implements feedback control through temperature sensors that monitor the temperature of air reaching heat sources and the operation status of heat-dissipation modules. The controller adjusts fan speeds and module activation based on real-time temperature data, optimizing the direct delivery of cold air to maintain maximum cooling effectiveness while adapting to changing thermal conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves improved heat dissipation efficiency by adaptively controlling temperature convergence, effectively cooling high-efficiency chips and electronic elements in confined spaces, outperforming traditional methods by ensuring the coldest air is directly utilized for heat sources.
Implementation Method 1
heat pipe
Implementation Method 2
heat-dissipation module comprises a cooling chip, a variable fan, a heat pipe and a vapor chamber
Implementation Method 3
vapor chamber
Implementation Method 4
heat-dissipation module comprises a cooling chip, a variable fan, a heat pipe and a vapor chamber for enhanced heat exchange
Implementation Method 5
variable fan
Implementation Method 6
ensuring rapid temperature convergence
Data Source
Figure 1
Figure 2
Figure 3
AI summary
An active heat-dissipation system (10) for a base station of a communication system includes a measuring module (4), configured to detect a temperature sensing signal of the base station; a controller (1), configured to receive the temperature sensing signal detected by the measuring module (4) to set a preset temperature signal, to generate a difference between the temperature sensing signal and the preset temperature signal and a time derivative of the difference, and to output a control signal according to the difference and the time derivative of the difference based on a control program; and a power module (2), configured to receive the control signal and output an electrical signal to a heat-dissipation module (3) according to the control signal, such that the heat-dissipation module (3) performs a heat-dissipation process for the base station according to the electrical signal.