Active Heat-Spreading Element in Semiconductor Package
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Solution Overview
Problem
Conventional semiconductor packages face challenges in efficiently dissipating heat generated by high-density chips due to the use of passive heat-spreading elements, which also apply pressure to the chip and hinder direct heat convection to the environment.
Innovation Solution
Incorporating an active heat-spreading element, such as a thermoelectric cooler, that is not covered by a passive heat-spreading element, allowing direct heat convection to the environment while preventing the weight of the passive element from transferring to the chip, thereby reducing pressure and enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a passive type heat-spreading element is used to dissipate heat, then the heat dissipation structure is simple, but the heat dissipation efficiency is low and the element applies pressure to the chip
Solution Approach 1:
The patent combines both passive type heat-spreading element and active type heat-spreading element in a single heat dissipation system. The passive element (heat spreader) is positioned above the active element (TEC), creating a layered structure that integrates natural convection with forced active cooling to achieve high heat dissipation efficiency while maintaining structural feasibility
Solution Approach 2:
The heat dissipation function is segmented into two distinct components: the passive heat spreader for natural heat distribution and the active TEC element for forced heat pumping. This segmentation allows each component to perform its specialized function optimally without interfering with the other, resolving the contradiction between structural simplicity and cooling efficiency
2Stability of the object's composition
If a passive type heat-spreading element is placed above the active type element, then the structure is stable, but the weight of the passive element transfers to the chip increasing pressure
Solution Approach 1:
The patent introduces a support structure as an intermediary element between the passive heat spreader and the chip. This support structure bears the weight of the passive heat spreader, preventing the force from being transmitted to the chip. The intermediary support maintains structural stability while isolating the chip from excessive pressure, effectively resolving the contradiction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables fast and efficient heat dissipation from the chip to the environment through the active element while minimizing pressure on the chip, ensuring effective thermal management without transferring weight or pressure from the passive element.
Implementation Method 1
an active type heat-spreading element, such as a thermoelectric cooler
Implementation Method 2
The heat spreader 12 is attached on the stiffener 20 by a second adhesive 44. A thermally conductive material (TIM) 46 is disposed between the back surface 34 of the chip 30 and the heat spreader 10 for helpfully dissipating the heat resulted from the chip 30 during operation
Data Source
AI summary
A semiconductor package includes a carrier, a chip, a stiffener, a heat spreader and an active type heat-spreading element. The chip and the stiffener are disposed on the carrier. The heat spreader is disposed on the stiffener and includes a through opening. The active type heat-spreading element is disposed on the chip and located in the through opening.