Active Heat Transfer to Docking Device for Portable Computing Thermal Mitigation
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Solution Overview
Problem
Portable computing devices face challenges in efficiently dissipating excess heat generated by powerful components, especially during fast charging, due to their compact and sealed cases, which limit passive conduction and impact user experience.
Innovation Solution
Implementing an active heat transfer system within the PCD that transfers thermal energy to a docking device through a thermal coupler and thermoelectric cooler, utilizing a heat pipe for efficient heat dissipation when docked.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If passive conduction through the PCD case is used for heat dissipation, then the device structure remains simple and compact, but the heat dissipation efficiency is insufficient and user comfort deteriorates
Solution Approach 1:
The patent introduces a docking device as an intermediary heat dissipation pathway. The thermal coupler serves as a mediator that transfers heat from the PCD's internal components through the docking connector to the docking device's heat sink, enabling efficient heat dissipation without complicating the PCD's internal structure.
Solution Approach 2:
The patent shifts heat dissipation from the traditional internal dimension (within the sealed PCD case) to an external dimension (through the docking connector to the docking device). This dimensional transition allows the PCD to offload thermal management complexity while maintaining its compact sealed design.
2Volume of moving object
If the PCD case is kept sealed and compact, then portability is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The docking connector acts as an intermediary thermal pathway that extends the heat dissipation capability beyond the compact sealed case. Heat is conducted through the connector to the docking device, effectively bypassing the limitation of the sealed case design.
Solution Approach 2:
The thermal management system is segmented between the PCD and the docking device. The PCD generates heat and transfers it through the thermal coupler and docking connector, while the docking device provides the heat sink function. This segmentation allows the PCD to remain compact while achieving effective heat dissipation externally.
3Temperature
If thermal mitigation techniques like DCVS are applied, then heat generation is reduced, but device performance deteriorates
Solution Approach 1:
The docking device serves as an external intermediary for heat dissipation, allowing the PCD to maintain high performance without relying on aggressive thermal mitigation techniques like DCVS. The active heat transfer system provides an alternative pathway that preserves device performance while controlling temperatures.
4Temperature
If active heat transfer features are added to the PCD, then heat dissipation efficiency is improved, but device complexity and power consumption increase
Solution Approach 1:
The docking device acts as an intermediary that provides active heat dissipation capabilities without requiring the PCD to contain complex active cooling components. The PCD's active heat transfer system is simplified to primarily include the thermal coupler and control circuitry, while the docking device houses the more complex heat dissipation mechanisms.
Solution Approach 2:
Complex active heat dissipation features are extracted from the PCD and placed in the docking device. The PCD retains only the essential thermal coupling components, while the docking device provides the substantial active cooling infrastructure, thereby reducing PCD complexity and power consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively mitigates thermal buildup by actively transferring heat to the docking device, maintaining device performance and user comfort without throttling, thus enhancing thermal management in portable devices.
Implementation Method 1
a thermoelectric cooler (TEC) thermally coupled to the thermal coupler. The heat pipe may be configured to transfer thermal energy from the first end to the second end. The TEC may be configured to transfer thermal energy from the second end of the heat pipe to the thermal coupler when activated.
Implementation Method 2
a heat pipe having a first end and a second end. The heat pipe may be configured to transfer thermal energy from the first end to the second end.
Implementation Method 3
The active heat transfer system may have a first portion thermally coupled to a heat source component within the PCD case and a second portion thermally coupled to the thermal coupler.
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
A PCD may include an active heat transfer system configured to transfer heat from the PCD to a docking device. The active heat transfer system may include a thermoelectric cooler, a heat pipe, or other heat transfer elements. The active heat transfer system may, based on temperature measurements, be activated when the PCD is coupled to the docking device.