Active Implant Interposer for Aligned Feedthrough Connections
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Solution Overview
Problem
Existing methods for establishing electrical connections between a feedthrough and a printed circuit assembly (PCA) in active implantable medical devices are complex, requiring multiple components and processes that can increase device size and complexity, and may not be suitable for high-volume production.
Innovation Solution
The use of an interposer with a dielectric over-mold structure and conductive leads, featuring weld and solder pads, that is integrated with a PCB portion to provide alignment and electrical coupling between the feedthrough and PCA, allowing for flexible design and laser welding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding or flex band methods are used to connect feedthrough and PCA, then electrical connection is established, but device complexity and interconnect complexity increase
Solution Approach 1:
The patent combines the feedthrough and PCA into a single integrated structure where electrical contacts extend directly from the feedthrough support structure to the PCA contact pads, eliminating the need for separate interconnect components like wire bonds or flex bands. This merging reduces interconnect complexity while maintaining reliable electrical connection.
Solution Approach 2:
The patent extracts and eliminates the intermediate interconnect components (wire bonds, flex bands, discrete connectors) from the electrical connection path. By removing these separate components and establishing direct electrical contact between feedthrough and PCA, the solution reduces device complexity while preserving electrical connectivity.
2Reliability
If multiple discrete components and processes are used for electrical interconnection, then connection is achieved, but manufacturing complexity increases and high-volume production becomes difficult
Solution Approach 1:
The feedthrough and PCA are merged into an integrated assembly where electrical contacts are formed as a continuous structure from the feedthrough support through to the PCA contact pads. This integration allows the entire electrical interconnection to be manufactured in a single process sequence rather than requiring multiple discrete assembly steps, thereby reducing manufacturing complexity and enabling high-volume production.
3Reliability
If traditional interconnection methods are used, then electrical connection is established, but device size increases
Solution Approach 1:
By merging the feedthrough and PCA into an integrated structure with direct electrical contacts, the patent eliminates the space required for discrete interconnect components such as wire bonds, flex bands, and separate mounting hardware. This integration reduces the overall device volume while maintaining reliable electrical connection between the feedthrough and PCA.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The interposer reduces interconnect complexity, facilitates miniaturization, and enables high-volume, cost-effective manufacturing with automated assembly methods, eliminating the need for discreet wires and continuous clamping.
Implementation Method 1
Each lead is integrated with the dielectric over-mold structure and includes a weld pad and a solder pad. Each solder pad of the interposer is electrically coupled to a corresponding PCB electrical contact to provide an alignment between one or more weld pads of the interposer and one or more corresponding IMD electrical contacts
Implementation Method 2
Each lead is integrated with the dielectric over-mold structure and includes a weld pad and a solder pad. Each solder pad of the interposer is electrically coupled to a corresponding PCB electrical contact
Data Source
AI summary
A printed circuit assembly (PCA) for coupling to an IMD feedthrough of an implantable medical device includes a PCB portion and an interposer. The IMD feedthrough has a support structure and a plurality of electrical contacts extending through the support structure. The PCB portion is configured to be arranged relative to the support structure of the IMD feedthrough and includes a plurality of electrical contacts. The interposer is secured to the PCB portion and includes a dielectric over-mold structure and a plurality of leads. Each lead is integrated with the dielectric over-mold structure and includes a weld pad and a solder pad. Each solder pads of the interposer is electrically coupled to a corresponding electrical contacts of the PCB portion to provide an alignment between one or more weld pads of the interposer and one or more corresponding electrical contacts of the IMD feedthrough.