Active Interposer Switching for Fine-Pitch Bond Misalignment
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Solution Overview
Problem
Accurately aligning finely-pitched contact pads during semiconductor element bonding is challenging due to misalignment tolerance in pick-and-place and bonding tools, leading to reduced electrical performance.
Innovation Solution
Implementing switching circuitry in the interposer or semiconductor elements to switch electrical connections between contact pads, ensuring correct alignment despite misalignments, and using direct hybrid bonding techniques without adhesives to form reliable connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If direct bonding of finely-pitched contact pads is performed, then interconnect density and electrical performance are improved, but misalignment between contact pads occurs due to tool tolerance
Solution Approach 1:
The patent changes the electrical parameters (resistance values) of the switching circuitry to adapt to misalignment conditions. By adjusting which switches are closed or open based on detected resistance values, the system compensates for misaligned contact pads and maintains reliable electrical connections.
Solution Approach 2:
The patent introduces an interposer as an intermediary element between the first and second semiconductor elements. The interposer contains switching circuitry that mediates the electrical connections, allowing the system to compensate for misalignment by routing signals through alternative paths when direct contact pad alignment fails.
2Reliability
If switching circuitry is added to compensate for misalignment, then electrical connection reliability is improved, but device complexity increases
Solution Approach 1:
The patent segments the interposer into distinct functional regions: bonding pad regions for direct connections and switching circuitry regions for active compensation. This segmentation allows the complex switching functionality to be localized and managed separately from the direct bonding interfaces.
Solution Approach 2:
The patent implements dynamic switching capability where the electrical connections can be reconfigured based on alignment detection results. The switching circuitry transitions from static fixed connections to dynamic reconfigurable connections, allowing the system to adapt to misalignment conditions by closing or opening specific switches based on detected resistance values.
3Adaptability or versatility
If multiple contact pads are used for switching, then misalignment compensation capability is improved, but bonding area requirements increase
Solution Approach 1:
The patent makes the contact pads multi-functional by using them for both direct bonding connections and as part of the switching circuitry network. The same bonding pad structure serves dual purposes: as a mechanical/electrical interface for direct connections and as a node in the reconfigurable switching network, eliminating the need for separate dedicated switching contacts.
Data Source
AI summary
A bonded structure is disclosed. The bonded structure can comprise a first semiconductor element having a first contact pad. An interposer can include a second contact pad on a first side of the interposer and a third contact pad and a fourth contact pad on a second side of the interposer opposite the first side, the second contact pad bonded to the first contact pad; a second semiconductor element having a fifth contact pad bonded to the third contact pad and a sixth contact pad bonded to the fourth contact pad. A switching circuitry can be configured to switch between a first electrical connection between the second and third contact pads and a second electrical connection between the second and fourth contact pads.