Active Interposer Multiplexing for Die Size Migration
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Solution Overview
Problem
Existing integrated circuit packages are not easily adaptable to integrate circuit dies of different sizes without requiring new package substrates, leading to increased costs and complexity in migrating packages to accommodate varying die sizes and IO block arrangements.
Innovation Solution
The implementation of an active interconnection device with multiplexer circuits that can reconfigure to couple integrated circuit dies of different sizes and IO block arrangements to the same conductive balls without changing the routing of conductors in the package substrate, using select signals to manage the multiplexer circuits and output buffer circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If package substrates are redesigned for each die size migration, then compatibility with different die sizes is improved, but device complexity and production costs increase
Solution Approach 1:
The patent implements a universal package substrate design that can accommodate multiple die sizes through reconfigurable interconnect structures. The substrate includes multiplexer circuits and programmable interconnect elements that can be dynamically configured to support different die geometries and IO block arrangements, eliminating the need for custom substrate designs for each die size migration.
Solution Approach 2:
The package substrate incorporates dynamic reconfiguration capabilities through programmable interconnect elements and multiplexer circuits that can change their connectivity patterns based on the specific die being mounted. This dynamic adaptability allows the same physical substrate to support multiple die sizes and IO configurations without requiring physical redesign.
2Adaptability or versatility
If new package substrates are created for each migration scenario, then routing compatibility is improved, but manufacturing costs increase
Solution Approach 1:
A single package substrate design serves multiple manufacturing scenarios by incorporating reconfigurable interconnect technology. The substrate can be programmed during assembly to match the routing requirements of different die sizes and IO block arrangements, eliminating the need to manufacture multiple substrate variants and reducing production costs.
Solution Approach 2:
The substrate's electrical connectivity parameters can be dynamically changed through programming the interconnect elements and multiplexer circuits. This allows the same physical substrate to present different routing configurations depending on which die is mounted, enabling cost-effective migration to different die sizes without creating new substrate designs.
3Ease of manufacture
If fixed routing is used in package substrate, then manufacturing simplicity is improved, but adaptability to different IO block arrangements deteriorates
Solution Approach 1:
The patent transforms fixed routing into dynamic routing by incorporating programmable interconnect elements and multiplexer circuits in the package substrate. These elements can be configured after manufacturing to match different IO block arrangements on various die sizes, maintaining manufacturing simplicity while enabling post-fabrication adaptability.
Solution Approach 2:
The reconfigurable interconnect structures act as intermediaries between the fixed physical substrate routing and the varying die IO block arrangements. By programming these intermediary elements, the system can accommodate different IO configurations without changing the underlying substrate manufacturing process.
Data Source
AI summary
An active interposer device includes a multiplexer circuit configurable to provide a first signal from a first integrated circuit to an external terminal of the active interposer device in a first configuration of the active interposer device. The multiplexer circuit is further configurable to provide a second signal from a second integrated circuit to the external terminal in a second configuration of the active interposer device. The second integrated circuit is larger than the first integrated circuit, and the active interposer device is configurable to couple the first integrated circuit or the second integrated circuit to a package substrate through the external terminal.