Active Interposer Buffering for Multi-HBM Signal Integrity
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Solution Overview
Problem
Existing passive interposers in 3D-IC and CoWoS technologies limit the number of HBM devices that can be connected to an SoC due to signal degradation issues, particularly affecting HBM devices farther away from the interposer.
Innovation Solution
Implementing an active interposer with a die circuit that maintains or enhances signal integrity between the SoC and HBM devices, using an active interposer with semiconductor dies and conductive layers to connect multiple HBM devices effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a passive interposer is used to connect semiconductor chips, then the surface area occupied by the semiconductor chip is reduced, but the number of HBM devices that can be connected is limited due to signal degradation
Solution Approach 1:
The patent introduces an active interposer containing buffer circuits as an intermediary component between the HBM devices and the SoC. This active interposer actively compensates for signal degradation by regenerating signals, thereby maintaining signal integrity while enabling connection of more HBM devices through the passive interposer structure.
Solution Approach 2:
The patent changes the electrical parameters of the interposer system by introducing active buffer circuits that can actively adjust signal strength, impedance, and timing characteristics. This allows the system to maintain reliable signal transmission over longer distances and through more interconnected devices, overcoming the limitations of passive interposers.
2Adaptability or versatility
If more HBM devices are connected to the SoC, then the functionality and performance of the system is enhanced, but signal degradation increases particularly for devices farther away
Solution Approach 1:
The active interposer with buffer circuits serves as a mediator that actively manages signal transmission to multiple HBM devices. The buffer circuits can selectively amplify and regenerate signals for each connected device, ensuring that even devices farther away maintain signal integrity while the system supports a larger number of connected HBM devices.
Solution Approach 2:
The patent segments the interconnection system into two functional parts: a passive interposer for physical routing and connection, and an active interposer with buffer circuits for signal management. This segmentation allows each part to optimize its function, enabling the system to connect more HBM devices while maintaining signal quality through active compensation.
3Area of stationary object
If HBM devices are placed farther from the interposer to reduce surface area, then space is conserved, but signal degradation becomes more severe
Solution Approach 1:
The active buffer circuits in the interposer change the effective electrical parameters of the connection by actively regenerating and amplifying signals. This allows HBM devices to be placed farther from the interposer on the package substrate without suffering from severe signal degradation, as the buffer circuits compensate for the increased distance and maintain signal integrity.
Data Source
AI summary
A system includes an active interposer and a plurality of semiconductor chips. The active interposer includes an interposer substrate, a semiconductor die, and a front-side redistribution layer (RDL). The semiconductor die is formed in the interposer substrate and includes a die substrate, an active die circuit, and a conductive layer. The active die circuit is fabricated over the die substrate and includes one or more active components. The conductive layer is connected to the active die circuit. The front-side RDL is connected to the conductive layer. The semiconductor chips are bonded to the front-side RDL. A method for manufacturing the system is also disclosed.