Active Thermal Interposer Zoning for Module-Level IC Test Temperature Control
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Solution Overview
Problem
Conventional thermal control systems for integrated circuit testing are limited in their ability to rapidly and accurately control temperature across different zones of a device under test, due to environmental chamber limitations and complex, expensive mechanisms for inserting and removing devices, which restricts the rate and efficiency of testing.
Innovation Solution
A method utilizing an active thermal interposer with multiple zones, each corresponding to a module of the device, which receives specific inputs for temperature control, including the temperature of a cold plate, junction temperature, power supply, and position within a thermal control profile, allowing for separate control of coolant supply and heating of each zone to achieve precise thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an environmental chamber is used to heat and cool the integrated circuit, then the device can be subjected to environmental stress testing, but the testing rate is limited due to the large volume of air and mass of mounting structures required within the chamber
Solution Approach 1:
The invention divides the thermal control system into multiple independent heating zones on the test fixture, each capable of being controlled separately. This segmentation allows different regions of the device under test to be subjected to different thermal conditions simultaneously, enabling faster and more efficient testing without requiring a large environmental chamber.
Solution Approach 2:
The patent implements local thermal control by providing independent heating elements for different zones on the test fixture. This allows specific local regions to be heated or cooled according to their specific testing requirements, rather than heating the entire chamber, thereby significantly reducing the thermal mass and increasing testing speed.
2Ease of operation
If complex mechanisms are used to perform insertions and removals of DUTs and testing apparatus into and out of test chambers, then device handling is enabled, but the mechanisms become expensive and limit the rate of testing
Solution Approach 1:
The invention extracts the thermal control function from the large environmental chamber and integrates it directly into the test fixture. This eliminates the need for complex insertion and removal mechanisms, as the device can be quickly placed on the fixture which already provides the required thermal environment, thereby speeding up the testing process.
3Device complexity
If a single temperature control system is used for the entire device, then the system is simpler to implement, but different portions of the device cannot be controlled at different temperatures
Solution Approach 1:
The test fixture is divided into multiple heating zones with independent control, allowing each zone to be temperature-controlled separately. This segmentation enables versatile thermal testing scenarios while keeping each individual zone relatively simple to control.
Solution Approach 2:
The multi-zone heating system provides universal thermal control capability that can accommodate various testing scenarios - whether single-temperature or multi-temperature testing is required. The system can be configured to provide different thermal conditions simultaneously or sequentially, making it adaptable to different device architectures and testing requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables simultaneous thermal management of multiple zones on a device under test during testing, enhancing testing efficiency and accuracy by allowing different portions of the device to be controlled at various temperatures, thereby overcoming the limitations of traditional systems.
Implementation Method 1
disposing a cold plate against a second side of the active thermal interposer device of the thermal management head
Implementation Method 2
individually controlling heating of each zone of the plurality of zones
Data Source
AI summary
Placing a first side of an active thermal interposer device of a thermal management head against a device under test (DUT). Disposing a cold plate against a second side of the active thermal interposer. The DUT includes a plurality of modules and the active thermal interposer device includes a plurality of zones, each zone of the plurality of zones corresponding to a respective module of the plurality of modules and operable to be selectively heated. Receiving a respective set of inputs corresponding to each zone of the plurality of zones. Performing thermal management of the plurality of modules of the DUT by separately controlling temperature of each zone of the plurality of zones by controlling a supply of coolant to the cold plate, and individually controlling heating of each zone of the plurality of zones.