Active LED Packages for High-Resolution Displays With Lower Driver Density
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional LED display technologies face challenges in achieving high resolution and efficiency due to the increasing complexity and cost associated with densely packed driver electronics, particularly as pixel pitches decrease, leading to thermal crowding and increased complexity.
Innovation Solution
The implementation of active electrical elements within LED packages that include driver devices, signal conditioning, memory, and thermal management, enabling active matrix addressing and self-configuring capabilities to maintain operating states and detect adverse conditions, thereby reducing the need for densely populated driver circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If pixel pitch is decreased to achieve higher resolution, then display resolution is improved, but driver electronics density and complexity increase
Solution Approach 1:
The patent divides the driver electronics functionality into two parts: a simplified driver circuit on the PCB and an active electrical element integrated within each LED package. This segmentation allows the PCB driver to remain simple while the LED package handles complex functions like maintaining operating states and color conversion, thereby achieving high resolution without proportionally increasing overall system complexity
Solution Approach 2:
The active electrical element is nested within the LED package structure itself, integrating control functionality directly into the light-emitting component. This nesting eliminates the need for separate dense driver circuits for each pixel, as the control logic is embedded within the LED package at the pixel level
2Measurement precision
If driver electronics are densely packed to control more pixels, then display resolution is improved, but thermal management becomes more difficult
Solution Approach 1:
By segmenting the control functionality into distributed active electrical elements within LED packages rather than centralized dense driver circuits, the patent reduces thermal concentration in any single area. Each LED package with its active element acts as an independent thermal zone, preventing thermal crowding even at high pixel densities
Solution Approach 2:
The patent moves control functionality from the two-dimensional PCB plane (where dense packing causes thermal issues) to the three-dimensional LED package structure, utilizing vertical integration and distributed packaging to spread thermal load across multiple spatial dimensions
3Device complexity
If active electrical elements are integrated into LED packages, then driver electronics complexity is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent merges the LED chip and active electrical element into a single integrated LED package unit. This combining of components into one manufacturable package simplifies the overall system architecture and allows standardization of the integration process, making manufacturing more consistent and precise through established packaging techniques
Data Source
AI summary
Active control of light emitting diodes (LEDs) and LED packages within LED displays is disclosed. LED packages are disclosed that include a plurality of LED chips that form at least one LED pixel for an LED display or an LED panel. Each LED package may include an active electrical element that is configured to receive a control signal and actively maintain an operating state, such as brightness or grey level while other LED packages are being addressed. Active electrical elements are disclosed that are configured to provide both forward and reverse bias states to LEDs to detect adverse operating conditions including reverse leakage and deviations to forward voltage levels. LED packages are also disclosed that may self-configure based on the manner in which various input or output lines are connected.