Active LED Pixel Control for High-Resolution Display Thermal Relief
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional LED display technologies face challenges in achieving high resolution and efficiency due to the complexity and cost associated with densely populated driver electronics and thermal management issues as pixel pitches decrease, leading to increased complexity and thermal crowding.
Innovation Solution
The implementation of active electrical elements within LED packages that can independently control and maintain the operating state of LED chips, including brightness and color, using advanced circuitry and communication protocols, allowing for active matrix addressing and reduced pulsing, thereby minimizing the need for dense driver electronics and improving thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If pixel pitch is decreased to achieve higher resolution displays, then display resolution is improved, but device complexity and thermal crowding increase due to densely populated driver electronics
Solution Approach 1:
The driver electronics functionality is segmented and distributed to individual LED packages rather than being concentrated on a separate driver board. Each LED package contains its own active electrical element that can independently control and maintain the operating state of its associated LED chips, eliminating the need for dense external driver electronics
Solution Approach 2:
Each LED package becomes self-sufficient by incorporating an active electrical element that can autonomously control and maintain the operating state of its LED chips. This self-service capability allows each pixel to independently manage its own driving conditions without requiring continuous external control signals
2Manufacturing precision
If pixel pitch is decreased to achieve higher resolution displays, then display resolution is improved, but thermal management becomes more difficult due to thermal crowing
Solution Approach 1:
Thermal management is segmented by integrating active electrical elements directly within each LED package, allowing for distributed heat dissipation. This eliminates the need for a separate densely populated driver board that would contribute additional thermal load to the system
Solution Approach 2:
The driver electronics are extracted from a separate dense circuit board configuration and integrated into individual LED packages. This extraction redistributes the thermal load across multiple discrete package locations rather than concentrating it in a single area, improving overall thermal management
3Device complexity
If conventional passive matrix addressing is used with LED displays, then device complexity is reduced, but operating efficiency decreases due to increased pulsing requirements
Solution Approach 1:
Each LED package with its integrated active electrical element can autonomously maintain its operating state, eliminating the need for continuous pulsing signals required by passive matrix addressing. This self-service capability allows LEDs to remain continuously driven at optimal brightness levels without the efficiency losses associated with rapid on/off pulsing
Solution Approach 2:
The active electrical elements enable continuous driving of LED chips at steady-state operating conditions, replacing the discontinuous pulsing action required by passive matrix addressing. This continuity of useful action improves operating efficiency by eliminating the energy losses and reduced luminous output associated with pulsed operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables higher resolution displays with reduced complexity and cost by allowing each LED pixel to maintain its operating state continuously, reducing the number of separate electrical devices needed and minimizing thermal issues, while also improving overall operating efficiency.
Implementation Method 1
Each LED package may include an active electrical element that is configured to receive a control signal and actively maintain an operating state
Implementation Method 2
Light emitting diodes (LEDs) are solid-state devices that convert electrical energy to light
Data Source
AI summary
Active control of light emitting diodes (LEDs) and LED packages within LED displays is disclosed. LED packages are disclosed that include a plurality of LED chips that form at least one LED pixel for an LED display or an LED panel. Each LED package may include an active electrical element that is configured to receive a control signal and actively maintain an operating state, such as brightness or grey level while other LED packages are being addressed. The control signal may be provided in a data stream that includes a plurality of data packets. Each data packet may include an identifier that enables each LED package of an array that receives the data packet to take one or more actions based on the identifier or a series of identifiers.


