Active-Matrix LED Packages for Small-Pitch Display Control
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Solution Overview
Problem
Conventional LED display technologies face challenges in achieving small pixel pitches while maintaining efficiency and reducing complexity and cost, particularly due to thermal crowding and increased density of driver electronics.
Innovation Solution
The implementation of active electrical elements within LED packages, which include volatile and non-volatile memory, driver elements, and signal conditioning components, allows for active matrix addressing and independent control of LED pixels, reducing the need for complex driver circuits and improving thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If pixel pitch is reduced for higher resolution displays, then image resolution is improved, but thermal crowding and complexity of driver electronics increase
Solution Approach 1:
The driver electronics are segmented and distributed across multiple LED packages rather than being concentrated on a single driver board. Each LED package contains its own driver circuitry, dividing the overall driver function into distributed units that reduce local complexity and thermal density.
Solution Approach 2:
The patent transitions from a two-dimensional arrangement where driver electronics are placed on a separate board to a three-dimensional integration where driver circuits are embedded within the LED package structure itself, utilizing vertical space and integrating components in multiple layers.
2Measurement precision
If pixel pitch is reduced for higher resolution displays, then image resolution is improved, but thermal management becomes more difficult
Solution Approach 1:
Thermal management is segmented by distributing heat-generating components across multiple separate LED packages rather than concentrating them in one location. Each package has its own thermal pathways and heat dissipation structures, preventing thermal accumulation in a single dense area.
Solution Approach 2:
The patent introduces intermediate thermal management structures within each LED package, such as heat sinks, thermal vias, and heat spreaders, that act as mediators between the LED chips and the surrounding environment, facilitating heat transfer and reducing thermal crowding.
3Illumination intensity
If conventional LCD systems use polarizers and color filters, then color display is achieved, but light utilization efficiency is reduced
Solution Approach 1:
The patent extracts and removes the polarizers and color filters from the display system, replacing them with self-emissive LED elements that generate light directly in the desired colors. This eliminates the light loss associated with filtering and polarization, as each LED emits its native wavelength without requiring optical filters.
4Extent of automation
If driver electronics are densely populated on a single board, then control of multiple LEDs is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The control function is segmented and distributed across multiple identical LED packages, each containing simplified driver circuitry. This modular approach allows for standardized manufacturing of individual packages that can be assembled through repetition, reducing overall manufacturing complexity compared to building a single complex driver board.
Solution Approach 2:
Each LED package is designed as a universal module that contains all necessary driver electronics and control functions integrated within it. This multi-functional integration allows any package to operate independently, simplifying manufacturing and assembly processes while maintaining full control capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables LED displays with smaller pixel pitches, improved light utilization efficiency, reduced complexity and cost, and enhanced thermal management, leading to more efficient and reliable LED display technologies.
Implementation Method 1
Light emitting diodes (LEDs) are solid-state devices that convert electrical energy to light and generally include one or more active layers of semiconductor material
Data Source
AI summary
Active control of light emitting diodes (LEDs) and LED packages within LED displays is disclosed. LED packages are disclosed that include a plurality of LED chips that form at least one LED pixel for an LED display. Each LED package may include an active electrical element that is configured to receive a control signal and actively maintain an operating state, such as brightness or grey level while other LED packages are being addressed. Active electrical elements may include active circuitry that includes one or more of a driver device, a signal conditioning or transformation device, a memory device, a decoder device, an electrostatic discharge (ESD) protection device, a thermal management device, and a detection device, among others. In this regard, each LED pixel of an LED display may be configured for operation with active matrix addressing.