Active Matrix Driver Layout With Split TFT Materials
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge lies in designing an active matrix device that balances high pixel density with low power consumption and reduced manufacturing costs, while also ensuring high driving capability and flexibility in semiconductor material selection for demultiplexer or multiplexer circuits, as existing technologies face issues with polysilicon's high leakage current and oxide semiconductor's low driving capability.
Innovation Solution
The active matrix device incorporates a flexible substrate with a demultiplexer or multiplexer circuit formed using polysilicon for high-speed operation and a TFT for pixels made of oxide or amorphous silicon, allowing for different semiconductor materials to be used based on performance needs, thereby reducing the non-display region and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If polysilicon is used for TFT in demultiplexer circuits, then driving capability and operation speed are improved, but leakage current increases
Solution Approach 1:
The patent applies different semiconductor materials to different functional regions: polysilicon is used specifically in the demultiplexer circuit where high-speed operation is critical, while oxide semiconductor is used in pixel TFTs where low leakage current is paramount. This localized material selection optimizes each region's performance characteristics without compromising the other.
2Use of energy by moving object
If oxide semiconductor is used for TFT in pixels, then power consumption is reduced, but driving capability decreases
Solution Approach 1:
The patent applies different semiconductor materials to different functional regions: polysilicon is used specifically in the demultiplexer circuit where high-speed operation is critical, while oxide semiconductor is used in pixel TFTs where low leakage current is paramount. This localized material selection optimizes each region's performance characteristics without compromising the other.
3Ease of manufacture
If driver IC functions are incorporated into the active matrix substrate, then manufacturing costs are reduced, but design flexibility is constrained
Solution Approach 1:
The patent segments the driver unit into two distinct parts: a flexible substrate containing the demultiplexer circuit and TFTs (which can be manufactured using existing flexible substrate processes), and a separate active matrix substrate containing pixels. This segmentation allows independent optimization of each part while maintaining overall integration, thus reducing manufacturing costs without sacrificing design flexibility.
Solution Approach 2:
The patent employs a composite structure combining flexible substrate technology with active matrix substrate technology. The flexible substrate portion can be manufactured using established flexible display processes, while the active matrix substrate maintains its conventional structure. This composite approach enables cost reduction through process standardization while preserving design freedom in each subsystem.
Data Source
AI summary
A display device includes an active matrix substrate including a plurality of pixels and a driver unit. The driver unit includes a flexible substrate, a first wiring pattern disposed on the flexible substrate, a demultiplexer circuit or a multiplexer circuit supported by the flexible substrate and connected to the first wiring pattern, and a source driver IC supported by the flexible substrate and connected to the first wiring pattern. The driver unit is connected to a display panel, and a TFT of the plurality of pixels and a TFT of the demultiplexer circuit or the multiplexer circuit have semiconductors different from each other.