Active Matrix Substrate Dummy Apertures Stress Relief
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Solution Overview
Problem
Active matrix substrates face issues with film detachment at line connecting portions, leading to connection insufficiencies and reduced reliability due to stress-related delamination of organic insulating films during heat treatment.
Innovation Solution
Incorporating a structure with dummy apertures in the organic insulating layer that surround the connecting portions, these apertures relieve stress by dispersing contraction-related tension, thereby reducing the likelihood of film detachment and enhancing connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an organic insulating layer is used as an interlayer insulating layer in line connecting portions, then ease of manufacture is improved, but film detachment occurs at the aperture edge leading to connection insufficiencies
Solution Approach 1:
The organic insulating layer is segmented by introducing dummy apertures that divide the continuous layer into separate regions. This segmentation relieves stress concentration at the aperture edges of line connecting portions, preventing film detachment while maintaining the ease of manufacturing with organic insulating materials.
Solution Approach 2:
Dummy apertures are strategically positioned in specific regions where stress concentration is most likely to occur during heat treatment. This local modification of the organic insulating layer's structure provides targeted stress relief at critical aperture edges without compromising the overall insulating function.
2Manufacturing precision
If heat treatment is performed during manufacturing, then material properties are improved, but contraction-related tension causes film detachment
Solution Approach 1:
Dummy apertures are incorporated into the organic insulating layer before heat treatment to preemptively cushion against contraction-related tension. These apertures act as stress relief features that prevent film detachment during the heat treatment process, allowing material properties to be improved without compromising film strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively suppresses film detachment and connection insufficiencies by relaxing stress in the organic insulating layer, thereby improving the reliability and yield of active matrix substrates.
Implementation Method 1
the organic insulating film may become detached at the aperture edge... due to stress-related delamination of organic insulating films during heat treatment
Data Source
AI summary
An active matrix substrate includes, in a peripheral region that is disposed around a display region, a connecting portion formation region in which a plurality of line connecting portions are arranged. Each line connecting portion includes: a lower connecting portion; an organic insulating layer disposed on the lower connecting portion so as to be in contact with the lower connecting portion, the organic insulating layer having at least one aperture through which a part of the lower connecting portion is exposed; and an upper connecting portion disposed on the organic insulating layer and in the at least one aperture, the upper connecting portion being directly in contact with the part of the lower connecting portion within the at least one aperture. The organic insulating layer extends into an adjoining region that adjoins the connecting portion formation region. In the adjoining region, the organic insulating layer has a plurality of dummy apertures that are disposed so as not to overlap the lower connecting portions when viewed from the normal direction of the substrate, each dummy aperture exposing a part of an underlying layer that is located on the substrate side of the lower connecting portion. The upper connecting portions are not provided in the plurality of dummy apertures.