Active Matrix Substrate Frame Width Reduction
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Solution Overview
Problem
In active matrix substrates with a three-side-free structure, the frame region width along the terminal region is not minimized effectively due to uniform arrangement pitches of unit circuit sections, leading to a larger frame size in mobile electronic equipment.
Innovation Solution
The active matrix substrate design features a larger arrangement pitch for outer unit circuit sections in the peripheral circuit compared to inner ones, with a specific configuration of signal lines and circuit sections that narrows from the display region towards the terminal region, reducing the frame width by aligning unit circuits and signal lines in a manner that reduces the angle with the display region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If uniform arrangement pitch is used for all unit circuit sections, then manufacturing simplicity is maintained, but frame region width is increased
Solution Approach 1:
The patent applies different arrangement pitches to different regions of the peripheral circuit section. Specifically, the first unit circuit sections (outer regions) have a first arrangement pitch, while the second unit circuit sections (inner regions) have a second arrangement pitch that is smaller than the first. This local differentiation allows the frame region width to be minimized by having tighter spacing in the inner regions where space is more constrained, while maintaining larger spacing in outer regions where more space is available.
2Length of stationary object
If unit circuit sections are arranged with larger pitch, then manufacturing precision is easier to achieve, but frame region width increases
Solution Approach 1:
The patent implements local quality by dividing the peripheral circuit section into two regions with different arrangement pitches. The inner region (second unit circuit sections) uses a smaller pitch to minimize frame width in the critical area near the display region, while the outer region (first unit circuit sections) uses a larger pitch that is easier to manufacture with standard precision. This regional differentiation optimizes both frame width and manufacturing feasibility.
3Length of stationary object
If frame region width is minimized, then device size is reduced, but circuit arrangement complexity increases
Solution Approach 1:
The patent segments the peripheral circuit section into two distinct parts: first unit circuit sections and second unit circuit sections. Each segment has its own arrangement pitch characteristic. This segmentation allows the complex task of minimizing frame width while accommodating all circuits to be divided into manageable regions with different design priorities, reducing overall arrangement complexity.
Solution Approach 2:
By assigning different arrangement pitches to different segments of the peripheral circuit, the patent creates local quality variations that simplify the overall arrangement problem. The inner region near the display uses tight spacing to minimize frame width, while outer regions use more relaxed spacing, making the circuit arrangement more systematic and less complex than a uniform approach would require.
Data Source
AI summary
In a region extending along a terminal region located near a substrate end and included in a frame region defined around a rectangular display region, a peripheral circuit section is provided between the display region and a mount region defined in part of the terminal region. The peripheral circuit section includes unit circuit sections that are monolithically provided and are aligned along one side of the display region. The arrangement pitch of outer ones of the unit circuit sections is larger than that of inner ones of the unit circuit sections.