Active Matrix Substrate Inspection for Short Circuit Detection
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Solution Overview
Problem
Conventional active matrix substrates lack a mechanism to reliably detect short circuits between adjacent extraction wirings formed on the same layer, which increases the likelihood of defective products and associated material and operating costs, especially with the trend towards more compact and higher definition liquid crystal panels.
Innovation Solution
The active matrix substrate incorporates a configuration with bundled wirings composed of adjacent connecting wirings, allowing for independent inspection signals to be input to third and fourth extraction wirings formed on the same and different layers respectively, enabling detection of short circuits between adjacent extraction wirings on the same layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If extraction wirings are formed on multiple layers to increase wiring density, then the spacing between extraction wirings can be reduced enabling more compact and higher definition liquid crystal panels, but a mechanism to detect short circuits between adjacent extraction wirings on the same layer is lacking
Solution Approach 1:
The extraction wirings are divided into multiple layers (first layer and second layer) with different spacing configurations. The first extraction wirings on the first layer have larger spacing, while the second extraction wirings on the second layer have smaller spacing. This segmentation allows dense wiring layout while maintaining detectability through the insulating layer structure.
Solution Approach 2:
An insulating material layer is introduced between the first extraction wirings and second extraction wirings. This intermediary layer serves dual purposes: it enables closer spacing of extraction wirings on the second layer while providing a detection mechanism for short circuits through its electrical insulation properties.
2Quantity of substance
If the number of extraction wirings is increased to support higher definition displays, then more gate terminals can be connected, but the active matrix substrate size cannot be increased due to compactness requirements
Solution Approach 1:
The patent transitions from a single-layer wiring structure to a multi-layer wiring structure. By adding the second layer with second extraction wirings, the system increases the quantity of extraction wirings without increasing the substrate area, effectively utilizing the vertical dimension to accommodate more connections.
Solution Approach 2:
The second extraction wirings are positioned to overlap or align with the first extraction wirings in the vertical direction, creating a nested configuration. This allows the second layer wirings to utilize the same horizontal space as the first layer, maximizing wiring density within the fixed substrate area.
3Productivity
If extraction wirings are formed closer together to increase wiring density, then more terminals can be connected in the same area, but short circuits between adjacent wirings become more likely
Solution Approach 1:
The extraction wirings are segmented into two groups on different layers: first extraction wirings with larger spacing on the first layer, and second extraction wirings with smaller spacing on the second layer. This segmentation allows the system to achieve high overall wiring density while maintaining larger spacing on the first layer where short circuits are more difficult to detect.
Solution Approach 2:
The insulating material layer acts as a mediator that enables close spacing of the second extraction wirings on the second layer while preventing short circuits between the two layers. The insulator provides electrical isolation, allowing high wiring density without proportionally increasing short circuit risk.
Data Source
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AI summary
An active matrix substrate (2) is provided with first connecting wirings (641, 643, 645, 647) connected to gate terminals (51) to which extraction wirings (611, 613, 615, 617) are connected, second connecting wirings (642, 644, 646) connected to gate terminals (51) to which extraction wirings (612, 614, 616) are connected, bundled wirings (651 to 654) each composed of a mutually adjacent first connecting wiring and second connecting wiring bundled together, a first inspection wiring (66) capable of inputting an inspection signal to bundled wirings (652, 654) that are not adjacent to each other among the bundled wirings, and a second inspection wiring (67) capable of inputting an inspection signal to bundled wirings (651, 653) that are not adjacent to each other and not connected to the first inspection wiring (66) among the bundled wirings.