Active Matrix Substrate Inspection Wiring for Short Circuit Detection
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Solution Overview
Problem
There is a lack of mechanisms for reliably detecting short circuits between adjacent connecting wirings on the same layer in active matrix substrates with multiple layers, which increases the risk of defective liquid crystal panels and associated material and operational costs.
Innovation Solution
The active matrix substrate incorporates a configuration with first and second connecting wirings on different layers, separated by an insulating material, and utilizes common switching elements and inspection signals to detect short circuits between adjacent wirings, reducing the number of inspection wirings and simplifying the inspection process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the number of wirings and terminals is increased to achieve higher definition, then the display quality is improved, but the active matrix substrate size increases
Solution Approach 1:
The patent applies multi-layer wiring configuration where connecting wirings are formed on different layers (first layer and second layer) to overlap in plan view. This vertical stacking approach allows more wirings to be packed into the same substrate area by utilizing the third dimension (layer depth), thereby increasing display definition without expanding substrate size.
2Device complexity
If connecting wirings are formed on the same layer to reduce layers, then the structure is simplified, but short circuits occur due to reduced spacing
Solution Approach 1:
The patent distributes connecting wirings across multiple layers (first layer and second layer) with insulating material between them. This vertical separation increases the effective spacing between adjacent wirings by utilizing the layer thickness dimension, preventing short circuits while maintaining a relatively simple overall wiring structure.
3Reliability
If inspection wirings are increased to detect all short circuits, then detection reliability is improved, but device complexity increases
Solution Approach 1:
The patent makes the first common wiring and second common wiring serve dual functions: they act as both signal transmission wirings for driving the display and as inspection wirings for detecting short circuits. By applying inspection signals through these common wirings to switching elements on different layers, the patent achieves comprehensive short circuit detection without adding dedicated inspection wiring, thus improving detection reliability while maintaining simple device structure.
Data Source
AI summary
An active matrix substrate is provided with first inspection wirings (70, 75) capable of inputting inspection signals to first switching wirings that are not adjacent to each other among the first switching wirings (69, 74) and to second switching wirings that are not adjacent to each other among the second switching wirings (69, 74), and second inspection wirings (72, 77) capable of inputting inspection signals to first switching wirings that are not adjacent to each other and not connected to the first inspection wirings among the first switching wirings (69, 74) and to second switching wirings that are not adjacent to each other and not connected to the first inspection wirings among the second switching wirings (69, 74).