Active Matrix Substrate Terminal Structure for In-Cell Touch
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Solution Overview
Problem
Existing in-cell touch panels face challenges in protecting metal layers from corrosion and efficiently connecting multiple touch lines to terminal portions without expanding the frame region.
Innovation Solution
The implementation of an active matrix substrate with a pixel electrode, common electrode, and signal lines, along with a terminal structure that includes a metal layer, contact layers, and interlayer insulating layers, where the touch lines are connected through relay wiring in different layers to facilitate connection without increasing the frame region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple touch lines are connected to the terminal portion, then the touch function is enhanced, but the frame region expands
Solution Approach 1:
The patent resolves the space conflict by transitioning to a three-dimensional layered structure. Multiple touch lines are connected through different layers (first touch line in one layer, second touch line in another layer) with vertical connections via contact holes. This dimensional transition allows multiple connections without increasing the horizontal frame region area.
Solution Approach 2:
The patent implements nesting by placing the second touch line and its connection structure within the vertical space above the first touch line connection region. The layered arrangement with contact holes penetrating through intermediate layers creates a nested configuration that accommodates multiple touch line connections within the same footprint.
Data Source
AI summary
An active matrix substrate includes: a signal line provided in an image display region; and a terminal provided in a frame region and electrically connected to the signal line. The terminal includes: a metal layer; a first contact layer located closer to one side in a lamination direction than the metal layer, and electrically connected to the metal layer, a first interlayer insulating layer located closer to the one side in the lamination direction than the first contact layer; and a second contact layer located closer to the one side in the lamination direction than the first interlayer insulating layer, and electrically connected to the first contact layer through a first through-hole formed in the first interlayer insulating layer. The first contact layer is made of a transparent metal oxide or a semiconductor material doped with impurities.