Active Matrix Substrate Wiring Connection Structure
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Solution Overview
Problem
The existing manufacturing method for active matrix substrates in liquid crystal panels often results in step disconnections at the pattern ends of common main wiring connections, leading to display failures such as cross-talk due to rounding of the common electrode signal.
Innovation Solution
The active matrix substrate is designed with a laminated wiring structure for both gate and data lines, including a common electrode and connecting units with specifically shaped contact holes to facilitate electrical connections between different wiring layers, reducing the likelihood of step disconnections and improving signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the existing manufacturing method is used to form connecting electrodes at pattern ends of common main wiring, then the manufacturing process can be completed, but step disconnections occur leading to display failures
Solution Approach 1:
The patent applies preliminary action by forming a protrusion on the common main wiring before forming the connecting electrode. This protrusion serves as a pre-prepared structural feature that prevents step disconnection when the connecting electrode is subsequently formed. The protrusion is created during the wiring formation process, before the connecting electrode fabrication, ensuring that the electrode has a stable base to connect to without stepping off the pattern edge.
2Reliability
If common main wiring connections are formed at pattern ends, then wiring connections can be established, but rounding of common electrode signal occurs causing cross-talk
Solution Approach 1:
The protrusion is formed in advance on the common main wiring at the connection position. This preliminary structural preparation ensures that when the connecting electrode is formed, it connects to a raised surface rather than a flat pattern end, preventing signal rounding and eliminating the source of cross-talk interference.
3Ease of manufacture
If the connecting electrode is formed without a protrusion structure, then the manufacturing process is simpler, but step disconnections occur at pattern ends
Solution Approach 1:
The protrusion is integrated into the common main wiring formation process itself, using the same photomask and patterning steps. This means no additional manufacturing steps are required beyond what is already needed for the wiring, while still providing the structural benefit of preventing step disconnection. The protrusion is created as part of the normal fabrication sequence.
Data Source
AI summary
An active matrix substrate for a liquid crystal panel of an FFS mode includes a plurality of connecting units in a connecting region in order to electrically connect a common electrode, a first common main wiring 31, and a second common main wiring 32. The connecting unit includes a contact hole 41 that connects a connecting electrode 37 and the first common main wiring 31, the connecting electrode 37 formed integrally with the common electrode, and a contact hole 42 that connects the connecting electrode 37 and the second common main wiring 32. An amorphous Si film 122 of the second common main wiring 32 is formed larger than a main conductor part 131 of the second common main wiring 32 in a position of the contact hole 41, and is covered with SiNx films 151, 152 that are protective insulating films. This prevents the connecting electrode from having a step disconnection at a pattern end of the common main wiring.