3D Stacking Active Devices Over Passive Components
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Solution Overview
Problem
Conventional methods for increasing substrate density in semiconductor modules, such as stacking active devices over integrated passive devices, are costly and time-consuming, and do not effectively reduce the space required by passive devices, making them undesirable for low-cost, high-volume applications.
Innovation Solution
Stacking active devices over surface mount passive components, using conductive or non-conductive adhesives to connect them, and encapsulating with a molding compound, allowing for high-density packaging without the need for expensive integrated passive devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If active devices are stacked over integrated passive devices, then substrate density increases, but manufacturing cost and time increase
Solution Approach 1:
The patent transitions from two-dimensional planar arrangement to three-dimensional stacking by placing active devices vertically over passive devices. This dimensional change allows multiple device layers to coexist in the same footprint area, significantly increasing substrate density without requiring expensive integrated passive devices, as standard surface-mount passive components can be used in the lower layer
Solution Approach 2:
The patent combines active devices and passive devices into a single integrated module package. By merging these different device types into one compact three-dimensional structure, the patent achieves high substrate density while using cost-effective standard passive components rather than expensive integrated passive devices
2Quantity of substance
If active devices are stacked over integrated passive devices, then substrate density increases, but assembly time increases
Solution Approach 1:
The patent prepares adhesive layers on passive devices before stacking active devices on top. This preliminary action of pre-applying adhesive simplifies the stacking process and reduces assembly time compared to more complex bonding procedures that would be required for integrated passive devices
Solution Approach 2:
By moving to three-dimensional stacking with standard passive devices in the lower layer, the patent simplifies the assembly process while achieving high density. The use of standard surface-mount passive components rather than integrated passive devices enables faster, more straightforward assembly procedures
3Ease of manufacture
If standard surface mount passive devices are used instead of integrated passive devices, then manufacturing cost decreases, but substrate area increases
Solution Approach 1:
The patent resolves the area issue by transitioning to three-dimensional stacking. Standard surface-mount passive devices are placed in the lower layer, and active devices are stacked vertically above them. This vertical arrangement allows both device types to share the same footprint area, maintaining compact substrate size while using cost-effective standard passive components
Solution Approach 2:
By merging active and passive devices into a single three-dimensional module structure, the patent enables standard passive devices to be used without increasing overall substrate area. The combined structure allows efficient space utilization where passive devices occupy the lower layer and active devices occupy the vertical space above
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces substrate size and increases device density while enabling faster, lower-cost assembly and improved design flexibility, achieving the same or greater functionality in a smaller package form factor.
Implementation Method 1
an active device adhered to the upper surface of the at least one passive surface mount component by an adhesive
Data Source
AI summary
Single-die or multi-die packaged modules that incorporate three-dimensional integration of active devices with discrete passive devices to create a package structure that allows active devices (such as, silicon or gallium-arsenide devices) to share the same footprint area as an array of passive surface mount components. In one example, a module includes at least one active device stacked on top of an array of passive surface mount components on a substrate. A conductive or non-conductive adhesive can be used to adhere the active device to the array of passive devices.