Active Shield Layer for Backside Attack Detection in ICs
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Solution Overview
Problem
Integrated Circuits (ICs) are vulnerable to backside attacks, where unauthorized access or modification can occur through the substrate, which existing protection methods fail to effectively block or detect, especially when using Focused Ion Beams (FIB) or other beams.
Innovation Solution
An active shield layer is integrated within the routing layers of the IC, comprising metallic traces that conduct active-shield signals to detect and interpose between the attack and electrical signals, preventing or mitigating backside attacks without requiring additional design or production steps and increasing the IC's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an active shield layer is integrated within the routing layers, then security against backside attacks is improved, but device complexity increases
Solution Approach 1:
The active shield layer is merged with the routing layers by integrating it within the same layer structure. The shield uses the same metallic trace technology and fabrication process as the routing layers, combining security functionality with existing signal routing infrastructure without adding separate protective layers or structures.
Solution Approach 2:
The metallic traces in the routing layers serve dual purposes: they conduct electrical signals for device operation and simultaneously function as the active shield for detecting backside attacks. This multi-functionality eliminates the need for dedicated shield structures, reducing overall device complexity while maintaining security.
2Reliability
If the active shield layer is disposed within a routing layer nearest to the substrate, then protection effectiveness is improved, but manufacturing precision requirements increase
Solution Approach 1:
The active shield is combined with the routing layer nearest to the substrate, utilizing the same fabrication process and layer structure. This merging eliminates the need for separate shield layer deposition and alignment, thereby reducing manufacturing precision requirements while achieving effective protection.
Solution Approach 2:
The routing layer structure serves itself by simultaneously providing both signal routing and active shielding functions. The metallic traces inherently provide the shield functionality without requiring additional manufacturing steps or precision alignment, as the same layer performs both functions.
3Reliability
If the combined footprint of active devices and metallic traces interposes between the attack and electrical signals, then security is improved, but area occupied increases
Solution Approach 1:
The metallic traces of the active shield are merged with the routing layer infrastructure, sharing the same physical space and fabrication process. This combining allows the shield to provide security coverage without occupying additional area beyond what is already required for signal routing.
Solution Approach 2:
The routing layer metallic traces perform dual functions: conducting electrical signals and providing active shielding coverage. This multi-functionality ensures that security protection is achieved without increasing the area occupied, as the same traces serve both purposes simultaneously.
Data Source
AI summary
An electronic apparatus includes, a substrate, one or more routing layers, and an active shield layer. The substrate includes active devices. The routing layers are electrically connected to the active devices and are configured to route electrical signals to and from the active devices. The active shield layer is disposed within a routing layer nearest to the substrate, the active shield layer includes metallic traces configured conduct active-shield signals that provide an indication of an attack on the apparatus.