Active Substrate Temperature Control for Deposition CTE Mismatch
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Solution Overview
Problem
Existing deposition processing systems face issues with thermal stress and CTE mismatch between chamber components, leading to warping, deformation, and contamination of thin films due to thermal coatings that fail to address these issues effectively.
Innovation Solution
Implementing a heating/cooling mechanism with temperature control to manage thermal energy and maintain substrate temperature within a target range, using thermocouples and a controller to adjust temperature independently of other chamber variables, thereby controlling CTE mismatch and reducing deformation and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal coatings are applied to protect chamber components from harsh environments, then component protection is improved, but CTE mismatch and thermal non-uniformity increase causing deformation and particle generation
Solution Approach 1:
The patent applies active temperature control to dynamically adjust the temperature of chamber components during deposition processes. By controlling temperature parameters in real-time, the system compensates for CTE mismatch effects and prevents thermal non-uniformity, thereby maintaining component dimensional stability while still using protective thermal coatings.
Solution Approach 2:
The system employs temperature sensors and control algorithms to continuously monitor and adjust component temperatures. This feedback mechanism detects thermal deviations and applies corrective heating or cooling to maintain target temperatures, preventing deformation caused by thermal gradients and CTE mismatch during deposition operations.
2Productivity
If material is deposited over ESC and chamber components, then thin film formation is achieved, but thermal energy rapidly heats components causing CTE mismatch and warping
Solution Approach 1:
The system pre-heats or pre-cools chamber components to target temperatures before initiating material deposition. This preliminary temperature adjustment ensures components are at the optimal thermal state to withstand the thermal energy from deposited material, preventing rapid heating and subsequent CTE mismatch-induced warping during the deposition process.
Solution Approach 2:
Active temperature control dynamically adjusts component temperatures during deposition by modifying heating/cooling power levels. This real-time parameter control compensates for thermal energy input from deposited material, maintaining stable component temperatures and preventing warping while enabling continuous high-productivity thin film formation.
3Strength
If thermal coatings are used to protect components, then erosion resistance is improved, but particle generation and contamination increase due to coating deformation and delamination
Solution Approach 1:
The system maintains protective thermal coatings by dynamically controlling component temperatures to prevent thermal stress-induced coating degradation. By adjusting temperature parameters in real-time, the system prevents coating deformation and delamination that would otherwise generate particles and contaminate deposited thin films, thereby preserving both erosion resistance and film quality.
Solution Approach 2:
Temperature control feedback mechanisms monitor component temperatures and adjust heating/cooling to maintain coatings within safe thermal operating ranges. This prevents thermal excursions that cause coating stress, deformation, and delamination, thereby eliminating the source of particle generation while maintaining the protective erosion-resistant coating integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The active temperature control system reduces thermal stress, maintains uniform film deposition, and enhances production yields by minimizing deformation and contamination, allowing for improved adhesion and mechanical toughness of thin films.
Implementation Method 1
a heating/cooling mechanism for supplying thermal energy to or removing thermal energy from a component or substrate
Implementation Method 2
temperature measurements taken of the substrate, as well as temperature measurements of the chamber and/or the deposition of material
Implementation Method 3
the thermal energy associated with the deposited material can create CTE mismatch within the chamber that results in warping and deformations
Data Source
AI summary
Several embodiments of the present technology are directed to actively controlling a temperature of a substrate in a chamber during manufacturing of a material or thin film. In some embodiments, the method can include cooling or heating the substrate to have a temperature within a target range, depositing a material over a surface of the substrate, and controlling the temperature of the substrate while the material is being deposited. In some embodiments, controlling the temperature of the substrate can include removing thermal energy from the substrate by directing a fluid over the substrate to maintain the temperature of the substrate within a target range throughout the deposition process.