Active Wire Feeding in Wire Bonding to Prevent Bond Wire Kinks
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Solution Overview
Problem
Existing wire bonding technologies face inefficiencies in forming bonds between conductive materials, particularly in battery modules, due to the need for frequent direction changes and the resulting kinks in bond wires, which can lead to failure points.
Innovation Solution
A wire bonding apparatus and method that includes a supply of bond wire, a first motor to advance the wire from a spool, a wedge for forming bonds, a wire guide, and a second motor to actively feed the wire after the first bond is formed, ensuring a length of wire is maintained between bonds to prevent kinking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If wire bonding is performed by moving the wire bonding head between locations, then bonds can be formed between different components, but the wire must frequently change direction which causes kinks and failure points
Solution Approach 1:
Instead of moving the wire bonding head to different locations and having the wire follow the head's movement path (which causes kinks), the invention inverts the approach by keeping the wire bonding head stationary and moving the substrate or wire feed system. This allows bonds to be formed at different locations without the wire undergoing frequent directional changes, thereby maintaining wire integrity while achieving adaptability.
Solution Approach 2:
The invention introduces an intermediary mechanism (such as a wire feed system or substrate positioning system) that mediates between the stationary wire bonding head and the target locations on the substrate. This intermediary allows the wire to be fed in a straight line while the bonding head remains fixed, eliminating kinks caused by wire direction changes while still enabling bonding at multiple locations.
2Productivity
If the wire bonding head moves to different locations on the substrate, then multiple bonds can be formed, but the wire length required increases and handling becomes more complex
Solution Approach 1:
The invention segments the bonding process by keeping the wire bonding head stationary at one location while the substrate or wire feed system moves to bring different bonding locations to the head. This segmentation allows multiple bonds to be formed without increasing wire length requirements or handling complexity, as the wire remains in a consistent, manageable path throughout the process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables more efficient bond wire installation in battery modules by reducing the need for direction changes and minimizing kinks, thereby enhancing the reliability and efficiency of bond formation.
Implementation Method 1
A piezoelectric element is shrunk by applying a voltage thereto, whereby an arm is turned around an axis and rollers are separated from each other
Implementation Method 2
ultrasonic waves are applied to a wedge for bonding a wire
Data Source
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AI summary
A wire bonding apparatus (100) comprises: a supply (108) of bond wire (102); a first motor (114) to advance the bond wire (102) from the supply (108); a wedge (110) to perform wire bonding by forming a first bond and a second bond, the second bond separated by a distance from the first bond; a wire guide (104) adjacent the wedge (110) for guiding the bond wire (102) toward the wedge (110); and a second motor (118) to advance the bond wire (102) into the wire guide (104), the second motor (118) configured to feed a length of the bond wire (102) after formation of the first bond and before formation of the second bond, the length greater than the distance between the first and second bonds.