Actively Cooled Processor Lid With Integrated Fluid Chamber
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Solution Overview
Problem
Existing heat-management systems for high-performance computer processors face inefficiencies in heat transfer due to multiple thermal interface materials and passive lids, which introduce resistance and limit heat dissipation, leading to potential damage and reduced lifespan.
Innovation Solution
An actively cooled heat-dissipation lid with a first plate in thermal communication with heat-generating devices, a fluid chamber, and integrated conduits for coolant flow, minimizing thermal interface materials and enhancing heat transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple thermal interface materials are used between the lid and heat-sink, then the thermal contact is improved, but the thermal resistance increases and heat transfer efficiency decreases
Solution Approach 1:
The patent removes the thermal interface material layer between the heat-sink and lid, extracting the harmful element that caused thermal resistance. The heat-sink is placed in direct contact with the lid, eliminating the thermal blanket effect and improving heat transfer efficiency while maintaining reliable thermal contact through precise surface mating.
2Stability of the object's composition
If a passive lid is used to spread heat, then the heat distribution is improved, but the heat removal efficiency is limited
Solution Approach 1:
The patent transitions from a static passive lid to a dynamic active cooling system. The lid incorporates an integrated heat-sink with coolant flow channels that actively remove heat through convection, while the lid's thermally conductive material continues to passively spread heat across its surface. This dynamic approach combines heat distribution with efficient heat removal.
Solution Approach 2:
The patent introduces a liquid coolant flowing through channels in the lid to actively remove heat. The hydraulic flow of coolant through the integrated heat-sink provides efficient heat extraction, replacing the limited passive conduction approach with an active fluid-based cooling system that significantly improves heat removal efficiency.
3Reliability
If heat-sinks are manually installed on lids, then the cooling capability is achieved, but the manufacturing time and labor increase
Solution Approach 1:
The patent merges the lid and heat-sink into a single integrated component. The heat-sink structure is formed as part of the lid itself, eliminating the separate installation step. This integration maintains full cooling capability while enabling automated manufacturing processes, significantly reducing manufacturing time and labor requirements.
Solution Approach 2:
The lid serves multiple functions: it acts as a thermal spreader, provides structural support, and incorporates the heat-sink with coolant channels for active cooling. This multi-functional design eliminates the need for separate heat-sink installation while maintaining comprehensive cooling capability, improving manufacturing efficiency.
4Strength
If the lid surface is made microscopically rough, then the bonding strength is improved, but air gaps form thermal blankets that reduce heat transfer
Solution Approach 1:
The patent uses a thin, compliant thermal interface layer that can accommodate surface roughness without creating significant thermal resistance. This sacrificial interface layer fills the air gaps caused by microscopic roughness, maintaining both bonding strength and heat transfer efficiency by eliminating the thermal blanket effect of trapped air.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables more efficient heat removal from densely packed semiconductor dies, supporting higher performance and power levels by reducing thermal resistance and improving cooling capabilities.
Implementation Method 1
a first plate configured to be placed in thermal communication with a heat-generating device
Implementation Method 2
An inlet conduit in fluid communication with the fluid chamber is configured to admit coolant fluid from a pressurized source to pass into the fluid chamber to absorb heat from the first plate
Implementation Method 3
A second raised sidewall extends from the opposite surface of the first plate to join with a second plate in a spaced relation to the first plate, so that the opposite surface of the first plate, the second raised sidewall and the second plate together define a fluid chamber
Data Source
AI summary
Actively cooled heat-dissipation lid for removing excess heat from heat-generating devices attached to printed circuit boards, processor assemblies and other electronic devices, the actively cooled heat-dissipation lid comprising a first plate configured to be placed in thermal communication with a heat-generating device, a raised sidewall to facilitate fastening the actively cooled heat-dissipation lid to the printed circuit board or processor assembly, and thereby defining a device chamber for the heat-generating devices on the printed circuit board to reside. A second raised sidewall extends from the opposite surface of the first plate to join with a second plate in a spaced relation to the first plate, wherein the opposite surface of the first plate, the second raised sidewall and the second plate together define a fluid chamber that is adjacent to the device chamber, the fluid chamber being configured to prevent any cooling fluid flowing therethrough to enter the adjacent device chamber. An inlet conduit in fluid communication with the fluid chamber is configured to admit coolant fluid from a pressurized source to pass into the fluid chamber to absorb heat from the second surface of the first plate in thermal communication with the heat-generating device. An outlet conduit in fluid communication with the fluid chamber is configured to let warmed coolant fluid flow out of the fluid chamber and into a closed loop fluid-cooling system, where the coolant fluid is then re-cooled before being pumped back into the fluid chamber via the inlet conduit.