Driver-Integrated Actuator Heat Dissipation via Extended Metal Conductor
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Solution Overview
Problem
The integration of electric actuators with drivers in high-temperature environments leads to potential malfunctions due to excessive heat generation, which is not effectively managed by existing solutions, hindering miniaturization and increasing costs.
Innovation Solution
Incorporating a driver circuit with a heat-conducting metal member that extends to the electric actuator, sealed by a heat-resistant resin, to efficiently dissipate heat generated by the driver circuit, thereby suppressing temperature rise without increasing external heat dissipation to the harness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the driver is integrated with the electric actuator, then miniaturization and cost reduction are achieved, but the driver is exposed to high temperature environment causing potential malfunction
Solution Approach 1:
The patent segments the driver into two functional parts: the driver circuit board (PCB) mounted on the electric actuator for control functions, and the power supply unit separated and mounted on the electronic substrate for power delivery. This segmentation allows the sensitive driver circuit to remain integrated (achieving miniaturization) while the power-generating components are separated (managing heat), thus resolving the contradiction between integration benefits and thermal management requirements.
2Ease of manufacture
If the driver is integrated with the electric actuator, then cost reduction is achieved, but heat dissipation becomes difficult leading to excessive temperature
Solution Approach 1:
The patent introduces a heat dissipation structure as an intermediary element between the driver circuit and the surrounding environment. This structure includes heat dissipation fins or extended surfaces that increase the effective heat transfer area, allowing efficient heat dissipation while maintaining the compact integrated design. The intermediary heat dissipation structure enables the system to achieve both cost reduction through integration and effective thermal management.
3Temperature
If heat-resistant materials are used to improve driver heat resistance, then temperature tolerance increases, but manufacturing cost increases
Solution Approach 1:
The patent applies local quality by using heat-resistant materials selectively only in the critical high-temperature zones where the driver circuit contacts or operates near heat-generating components. Rather than making the entire driver assembly heat-resistant (which would increase cost), only specific areas requiring thermal protection use specialized materials, while other areas use standard, cost-effective materials. This localized approach maintains necessary temperature tolerance while controlling manufacturing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the temperature of the driver integrated with the electric actuator, enhances heat dissipation performance, and maintains miniaturization while controlling costs.
Implementation Method 1
a heat-conducting portion (16) that mounts the driver circuit (15) and conducts heat generated in the driver circuit (15)
Data Source
AI summary
Provided are a driver and a driver-integrated electric actuator that can suppress a temperature rise of the driver integrated with an electric actuator. A driver circuit of an electric actuator-integrated driver controls a current to be supplied to an electric actuator. A metal member (heat-conducting portion) conducts heat generated in the driver circuit. A driver sealing portion is fixed to the electric actuator and seals the driver circuit and the metal member. The metal member is extended to the electric actuator.