Actuator Assembly PCB Overlap for Image Sensor Heat Dissipation
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Solution Overview
Problem
Existing actuator assemblies for optical image stabilization in miniature cameras face challenges in miniaturization and heat management, leading to potential overheating of image sensors due to tight packaging constraints.
Innovation Solution
An actuator assembly design where the first and second printed circuit boards (PCBs) overlap in a direction perpendicular to the plane of the first PCB, allowing for a reduced distance between the image sensor and the support structure, facilitating heat dissipation through the support structure as a heat sink, and reducing the overall height of the assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the PCBs are arranged in a traditional non-overlapping configuration, then the electrical connection between the first PCB and the second PCB is straightforward, but the distance between the image sensor and the support structure increases, reducing heat dissipation efficiency
Solution Approach 1:
The patent applies dimensional change by transitioning from a traditional planar PCB arrangement to a three-dimensional overlapping configuration. The first PCB and second PCB are arranged in different planes with vertical overlap, allowing electrical connections through vias and conductive structures that penetrate through the overlapping region. This spatial reconfiguration reduces the distance between the image sensor and support structure while maintaining electrical connectivity, thereby improving heat dissipation without excessive complexity increase.
2Volume of moving object
If the actuator assembly is miniaturized to fit portable devices, then the package size is reduced, but the heat dissipation capability deteriorates due to tighter packaging constraints
Solution Approach 1:
The patent implements nesting by placing the first PCB within the vertical projection area of the second PCB, creating a nested-like overlapping structure. The first PCB is positioned in a recess or cavity of the support structure, while the second PCB overlaps it from above. This nested arrangement maximizes space utilization in the miniaturized assembly, allowing heat to conduct from the image sensor through the second PCB and first PCB to the support structure, improving thermal management within compact dimensions.
3Temperature
If the distance between the image sensor and the support structure is reduced to improve heat dissipation, then the heat sink effectiveness increases, but the available space for electrical connections and actuator components decreases
Solution Approach 1:
The patent employs dynamic flexibility by making the first PCB flexible or bendable, allowing it to conform to the overlapping arrangement with the second PCB. The flexible first PCB can be positioned close to the support structure for effective heat dissipation while still providing sufficient volume for electrical connections through its flexible nature. This dynamic adaptation enables the system to achieve both thermal management goals and electrical connectivity requirements in a miniaturized configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the risk of image sensor overheating by enhancing heat dissipation and allows for a more compact actuator assembly, addressing the challenges of miniaturization and thermal management in portable electronic devices.
Implementation Method 1
the support structure can better act as a heat sink, dissipating heat away from the image sensor
Data Source
AI summary
An actuator assembly comprising: a support structure (4) comprising a first printed circuit board, PCB (10); an image sensor assembly (12) comprising a second PCB (9) and an image sensor (6) having a light-sensitive region (7), wherein the image sensor assembly (12) is supported on the support structure (4) to allow movement of the image sensor assembly (12) relative to the support structure (4); and an electrical interconnector (51) configured to electrically connect the first PCB (10) to the second PCB (9); wherein the first PCB (10) and the second PCB overlap (9) when viewed along at least one direction in the plane in which the first PCB (10) extends.