Actuator Device Resin Reinforcement Connection Layer
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Solution Overview
Problem
Existing actuator devices with piezoelectric materials face challenges in achieving high functional safety and efficient manufacturing, particularly in ensuring reliable electrical and mechanical stability of flexible printed circuit boards connected to actuators.
Innovation Solution
The actuator device incorporates a resin reinforcement material, specifically a mixture of epoxy resin and bismaleimide, which forms a connection layer between the printed circuit board and actuator connection coatings, providing mechanical stability and a safe galvanic connection, while maintaining performance across a wide temperature range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a flexible printed circuit board is used to connect actuators, then ease of operation and adaptability are improved, but mechanical stability and reliability deteriorate
Solution Approach 1:
The patent uses a composite material consisting of epoxy resin and bismaleimide (with 5-50 wt% bismaleimide) to create a connection layer that combines the flexibility needed for operation with the mechanical stability required for reliability. This composite material maintains performance across wide temperature ranges while providing stable electrical connections.
Solution Approach 2:
The patent modifies the chemical composition parameters of the connection layer by incorporating bismaleimide into the epoxy resin matrix. This parameter change enhances the material's temperature stability, moisture resistance, and mechanical strength while maintaining flexibility, thereby resolving the contradiction between ease of operation and reliability.
2Ease of manufacture
If conventional connection materials are used, then ease of manufacture is improved, but functional safety and manufacturing precision deteriorate
Solution Approach 1:
The patent changes the material composition parameters by using a specific mixture of epoxy resin and bismaleimide (5-50 wt% bismaleimide). This modified material composition improves connection quality, moisture resistance, and temperature stability while maintaining ease of application through conventional coating or injection methods.
Solution Approach 2:
The composite material system combines epoxy resin's ease of processing with bismaleimide's enhanced performance characteristics. This composite approach achieves high functional safety and manufacturing precision without significantly complicating the manufacturing process, as the material can be applied using standard techniques.
3Ease of manufacture
If standard resin materials are used for connection, then ease of manufacture is improved, but resistance to environmental factors and durability worsen
Solution Approach 1:
The patent employs a composite material system where bismaleimide (5-50 wt%) is incorporated into epoxy resin. This composite provides superior moisture resistance and temperature stability compared to standard resin materials, while remaining manufacturable through conventional processes. The bismaleimide component specifically enhances resistance to environmental degradation.
Solution Approach 2:
By modifying the resin composition to include 5-50 wt% bismaleimide, the patent changes the material's chemical and physical parameters to achieve enhanced moisture resistance, temperature stability, and fracture resistance. This parameter modification maintains ease of manufacture while dramatically improving resistance to harmful environmental factors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures a reliable and stable connection between the printed circuit board and actuators, reducing scrap rates and enhancing moisture resistance, with improved temperature stability and resistance to fracture and rupture, thus achieving high functional safety and efficient manufacturing.
Implementation Method 1
a connection layer is disposed which is made of a resin reinforcement material, wherein the connection layer at least in sections contacts side surfaces which delimit a respective connection area segment and which are opposed to each other, the surface section of the base body which is oriented in the thickness direction, the area of the printed circuit board which faces the surface section of the base body, in order to support the printed circuit board in the area of the respective connection area segments of a respective recess and to fix the printed circuit board to the actuator connection coatings
Data Source
AI summary
An actuator device (AV) including a main body (10) with a base body (10a) and a buildup body (10b) a plurality of actuators which are formed of actuator bodies comprising a piezoelectric or electrostrictive material and actuation electrodes and a printed circuit board (100) which extends in the longitudinal direction (X) of the actuator device (AV) over at least sections of actuator connection coatings, wherein conductive paths thereof are in electrical contact with the actuator connection coatings and wherein in the connection area segment (S0b, S1b, S2b, S3b) of the respective recess (S0, S1, S2, S3) at least in sections a connection layer (V) made of a resin reinforcement material with bismaleimide is disposed such that the connection layer (V) at least in sections contacts side surfaces (AS1, AS2) which respectively delimit a connection area segment (S0b, S1b, S2b, S3b) and which are opposed to each other.