Acute Angle Circuit Bonding Structure for Display Devices
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Solution Overview
Problem
In the display industry, bonding a driving circuit to a display panel using a flexible printed circuit (FPC) often results in deviations due to material expansion coefficients, leading to reduced effective contact areas and compromised package reliability.
Innovation Solution
A circuit bonding structure with a carrying portion and bonding region forming a preset acute angle, where the carrying portion is adjusted perpendicular to one side of the angle to increase the effective contact area, ensuring reliable bonding by matching the trace width and accuracy of the preset circuit board to the driving circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the carrying portion and bonding region are bonded directly without angle adjustment, then the bonding process is simple, but the effective contact area is reduced due to deviations from material expansion coefficients
Solution Approach 1:
The patent applies asymmetry by configuring the carrying portion and bonding region to form a preset acute angle (e.g., 45 degrees) rather than using a symmetric rectangular alignment. This angular configuration compensates for deviations caused by different material expansion coefficients, ensuring maximum effective contact area and reliable bonding between the carrying portion and bonding region.
2Productivity
If the carrying portion position is adjusted to increase effective contact area, then packaging efficiency improves, but the bonding process complexity increases
Solution Approach 1:
The patent implements preliminary action by pre-configuring the carrying portion and bonding region with a preset acute angle before the bonding process. This preliminary angular arrangement ensures that when the components are bonded, the effective contact area is automatically maximized without requiring complex real-time position adjustments, thus improving packaging efficiency while keeping the bonding process relatively simple.
3Reliability
If the trace width and accuracy are matched to the driving circuit, then bonding reliability improves, but the manufacturing precision requirements increase
Solution Approach 1:
The patent applies parameter changes by configuring the carrying portion and bonding region with a preset acute angle, which effectively changes the geometric parameters of the bonding interface. This angular configuration allows the trace width and accuracy to be optimized for the driving circuit while maintaining reliable bonding, as the angle compensates for manufacturing tolerances and material expansion differences.
Data Source
AI summary
The present disclosure relates to a circuit bonding structure, a circuit bonding method, and a display device. The circuit bonding structure includes a carrying portion configured to carry a driving circuit and having two sides which are adjacent to each other and form a preset acute angle and a preset circuit board having a bonding region having two sides which are adjacent to each other and form a preset acute angle. The driving circuit is bonded to the bonding region by the carrying portion.