Acyl Germanium Dielectric Film Composition for 405 Nm Patterning

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Solution Overview

Problem

Current dielectric materials for semiconductor packaging lack high-resolution capabilities and reliability at advanced processing speeds and high packing densities, particularly in forming dielectric films sensitive to longer UV wavelengths.

Innovation Solution

Incorporating acyl germanium compounds as photoinitiators or photosensitizers in dielectric film forming compositions to enhance resolution and pattern shape at longer UV wavelengths, such as 405 nm, while maintaining non-toxicity and improving film hardness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional photoinitiators are used in dielectric film forming compositions, then the composition can be processed at shorter UV wavelengths, but the resolution and pattern shape of the formed film deteriorate

Engineering Contradiction:
Improveresolution of dielectric filmVSAvoidpattern shape quality
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent changes the chemical structure parameter of the photoinitiator from conventional compounds to acyl germanium compounds, which enables the system to process at longer UV wavelengths (365-405 nm) while maintaining or improving resolution and pattern shape quality. This parameter change in the photoinitiator's molecular structure fundamentally alters the wavelength-response characteristics of the dielectric film forming composition.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite material strategy by combining acyl germanium compounds with specific resin systems (polyimide, cycloolefin polymer, acrylic compound) and optional crosslinking agents. This composite formulation creates a synergistic effect where the acyl germanium photoinitiator works optimally with the resin matrix to achieve high-resolution patterning at longer wavelengths that conventional single-component systems cannot accomplish.

Inventive Principle:
Principle #40Composite materials

2Productivity

If dielectric materials are designed for high packing density and advanced processing speeds, then productivity increases, but reliability and high-resolution capabilities deteriorate

Engineering Contradiction:
Improveprocessing speed and packing densityVSAvoiddielectric film quality and resolution
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent changes the operational parameter of UV wavelength from conventional shorter wavelengths (248-365 nm) to longer wavelengths (365-405 nm) using acyl germanium photoinitiators. This parameter change enables high-resolution patterning that maintains reliability even as productivity increases through advanced processing speeds and higher packing densities, because the longer wavelength system produces less scattering and better pattern fidelity.

Inventive Principle:
Principle #35Parameter changes

3Object-affected harmful factors

If photosensitive composition is optimized for longer UV wavelengths, then non-toxicity and film hardness improve, but sensitivity and resolution may deteriorate

Engineering Contradiction:
Improvetoxicity of compositionVSAvoidsensitivity to UV wavelength
Core Design Contradiction:
Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The patent changes the photoinitiator's absorption spectrum parameter to match longer UV wavelengths (365-405 nm) while using acyl germanium compounds that inherently provide high sensitivity at these wavelengths. This parameter optimization allows the system to be less toxic (avoiding hazardous short-wave UV) while maintaining or improving sensitivity and resolution through the enhanced quantum efficiency of acyl germanium compounds at longer wavelengths.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The use of acyl germanium compounds in dielectric film forming compositions enables the formation of high-resolution, patterned dielectric films with excellent shape and hardness, addressing the limitations of existing materials in semiconductor packaging.

Implementation Method 1

certain acyl germanium compounds can be used as a photoinitiator or a photosensitizer in a photosensitive dielectric film forming composition such that the composition can be developed at a relatively long UV wavelength (e.g., about 405 nm) to form a dielectric film

Methodology Applied
Scientific EffectPhotopolymerisation: Photopolymerisation

Implementation Method 2

it is believed that the acyl germanium compound described herein can act as a sensitizer and facilitate the generation of free radicals from the above radical initiator by synergistic effects

Methodology Applied
Scientific EffectPhotosensitization:

Data Source

PatentUS20240248400A1Dielectric film forming composition containing acyl germanium compound
Publication Date: 2024.07.25 FUJIFILM ELECTRONIC MATERIALS U S A INC
  • US20240248400A1 patent drawing
  • US20240248400A1 patent drawing
  • US20240248400A1 patent drawing

AI summary

This disclosure relates to a dielectric film forming composition that includes at least one resin; and at least one acyl germanium compound, as well as related processes, films, dry film structures, and articles.