Adaptable End Effector Vacuum Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate handling systems require different end effectors for various types and sizes of substrates, leading to inefficiencies and potential damage during handling.
Innovation Solution
An adaptable end effector with multiple vacuum outputs that can be selectively activated based on the type of substrate, featuring central and peripheral vacuum openings to accommodate both diced and non-diced wafers, preventing damage by adjusting vacuum application accordingly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If different end effectors are used for different substrate types, then substrate handling reliability is improved, but device complexity and operation efficiency deteriorate
Solution Approach 1:
The end effector is designed with multiple vacuum output locations (central, proximal peripheral, distal peripheral) that can be selectively activated to handle different substrate types including bare wafers and diced wafers, making a single device capable of performing multiple functions that previously required separate end effectors
2Reliability
If different end effectors are used for different substrate types, then substrate handling reliability is improved, but ease of operation deteriorates
Solution Approach 1:
The end effector incorporates dynamic control of vacuum application at different locations, allowing the system to adaptively select which vacuum outputs are active based on the substrate type being handled, enabling a single versatile end effector to replace multiple specialized ones and simplify operational procedures
3Force
If vacuum is applied at the end of the end effector for diced wafers, then substrate holding capability is improved, but substrate damage increases
Solution Approach 1:
The end effector applies vacuum at different locations depending on the substrate type: for diced wafers, vacuum is applied at proximal and distal peripheral locations away from the center to avoid damage to the diced structures, while for bare wafers, central vacuum application provides optimal holding capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and safe handling of diverse substrates by dynamically adjusting vacuum application, reducing the need for multiple end effectors and minimizing risk of damage during substrate transfer.
Implementation Method 1
The end effector has multiple vacuum outputs. Different types of substrates require the different vacuum outputs are required to provide vacuum
Data Source
AI summary
An adaptable end effector may include a substrate interface may be configured to support a substrate. The substrate interface may include multiple groups of vacuum openings that are associated with a plurality of types of substrates. A vacuum system may be configured to supply vacuum only to one or more selected groups of vacuum openings that are associated with a given type of substrates when the adaptable end effector supports a substrate of the given type of substrates.