Adaptable Heat Sink Fins for Variable Datacenter Cooling Loads

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Solution Overview

Problem

Air cooling systems in datacenters are inefficient in managing sudden high heat requirements due to changing computing loads, and traditional liquid cooling systems are economically unfeasible for meeting diverse cooling demands across different heat features in datacenter components.

Innovation Solution

The implementation of adaptable fins between heat sink plates that can change configuration from a contracted to an expanded state, exposing more surface area to the environment for enhanced heat dissipation, utilizing a bimorph material that changes shape with temperature, and assisted or unassisted motion features to adjust the fin configuration dynamically.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If air cooling systems are used in datacenters, then the cooling system is simple and economical, but the system cannot draw sufficient heat to support effective cooling when computing loads increase

Engineering Contradiction:

Improveheat dissipation capacityVSAvoidadaptability to varying heat requirements

Core Design Contradiction:

ProductivityVSAdaptability or versatility

Solution Approach 1:

The heat sink incorporates fins that can dynamically change their configuration between a first configuration (exposing more surface area) and a second configuration (exposing less surface area). This dynamic adjustment allows the heat sink to adapt its heat dissipation capacity to match varying computing loads and heat generation levels in real-time, resolving the contradiction between fixed cooling capacity and varying thermal demands.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system changes the physical parameter of surface area exposure by moving the fins between configurations. When computing loads increase and heat generation rises, the fins transition to the first configuration to expose more surface area for enhanced heat dissipation. When loads decrease, the fins move to the second configuration to reduce exposed surface area, thereby adapting the cooling performance to match actual thermal requirements.

Inventive Principle:

Principle #35Parameter changes

2Productivity

If liquid cooling systems are implemented to meet high cooling demands, then the cooling capacity increases, but the system becomes economically unfeasible for varying heat features

Engineering Contradiction:

Improvecooling capacityVSAvoideconomic feasibility

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The dynamically adjustable fin configuration enables an air cooling system to achieve variable cooling capacity that can meet high heat dissipation demands without requiring liquid cooling infrastructure. By exposing more fin surface area when needed, the system provides on-demand cooling capacity adjustment, eliminating the need for expensive liquid cooling systems while maintaining economic feasibility through simple mechanical adjustment mechanisms.

Inventive Principle:

Principle #15Dynamics

3Productivity

If the fin surface area is increased to enhance heat dissipation, then the cooling efficiency improves, but the device complexity increases due to movable components

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidstructural complexity of movable fins

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The fin structure utilizes thermal expansion and contraction of materials in response to temperature changes to automatically adjust between configurations. The thermal properties of the fin materials cause them to expand when heated by high computing loads, naturally exposing more surface area for enhanced heat dissipation, and contract when cooled, reducing exposed surface area. This passive thermal response mechanism achieves adaptive cooling without complex active control systems.

Inventive Principle:

Principle #37Thermal expansion

Solution Approach 2:

The heat sink system serves itself by using the heat it is designed to dissipate as the driving force for configuration adjustment. The thermal energy from high computing loads directly causes the fins to transition to the high-dissipation configuration through thermal expansion, eliminating the need for external actuators, sensors, or control systems. This self-service mechanism reduces device complexity while maintaining effective adaptive cooling.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution increases the cooling capability of both air and liquid cooling systems, allowing for efficient heat dissipation across varying heat loads by dynamically adjusting the fin configuration to match changing cooling requirements, thereby improving datacenter cooling efficiency and economy.

Implementation Method 1

dissipate a first amount of heat to an environment in a first configuration of the fins

Methodology Applied

Scientific EffectHeat dissipation: Convection

Implementation Method 2

heat sink to dissipate heat from a datacenter device

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20220322581A1Intelligent adaptable fins for cooling datacenter devices

Publication Date: 2022.10.06 NVIDIA CORP

AI summary

A cooling system for a datacenter device is disclosed. Fins are provided between a first plate and a second plate to dissipate a first amount of heat to an environment in a first configuration of the fins. The first plate is movable relative to the second plate to expose a surface area of the fins to the environment in a second configuration of the fins.