Adaptable Molded Leadframe Package for DIP to SIP Conversion
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Solution Overview
Problem
Conventional leadframe assemblies require significant redesign and increased manufacturing costs, time, and complexity when switching from a dual-in-line package to a single-in-line package, as existing solutions necessitate reconfiguration of semiconductor components and electrical routing.
Innovation Solution
The development of an adaptable molded leadframe package with continuous conductive structures that allow leads to protrude from both sides, enabling easy conversion from a dual-in-line package to a single-in-line package without reconfiguring internal structures, by maintaining electrical connectivity through remaining leads after trimming.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional leadframe assemblies use dual-in-line or single-in-line packages, then the package structure is simple and manufacturing is straightforward, but switching between package types requires complete redesign of semiconductor components and electrical routing, increasing manufacturing cost, time and complexity
Solution Approach 1:
The leadframe assembly is designed with a universal structure that can function in both dual-in-line and single-in-line package configurations. The leadframe includes opposing first and second leads that can be positioned to protrude from opposite sides (DIP mode) or from the same side (SIP mode), allowing the same basic structure to serve multiple package type functions without requiring complete redesign
Solution Approach 2:
The package structure incorporates dynamic configurability through optional lead trimming. The second lead can be trimmed to different lengths or removed entirely depending on the desired package type, enabling the assembly to adapt between DIP and SIP configurations. This dynamic adjustment capability allows easy conversion between package types while maintaining electrical functionality
2Adaptability or versatility
If conventional leadframe assemblies are converted from dual-in-line to single-in-line package, then the package type changes, but semiconductor components and electrical routing must undergo complete redesign, increasing manufacturing cost, time and complexity
Solution Approach 1:
The leadframe assembly is preliminarily configured with opposing first and second leads that are positioned and connected to semiconductor components before final package assembly. This preliminary configuration allows the same assembled structure to be adapted to different package types simply by adjusting lead positioning and trimming, eliminating the need for time-consuming redesign of component and routing configurations when converting between DIP and SIP packages
Solution Approach 2:
The conversion between package types is achieved by changing physical parameters of the leadframe structure, specifically the length and position of the second lead. By trimming the second lead to appropriate lengths or removing it entirely, the same leadframe assembly can be converted from DIP to SIP configuration without changing other critical parameters such as semiconductor component placement or electrical routing paths
3Reliability
If conventional leadframe assemblies require complete redesign for package conversion, then package functionality is maintained, but manufacturing cost increases
Solution Approach 1:
The leadframe is segmented into distinct functional portions: a first lead that remains substantially unchanged, and a second lead that can be trimmed or removed. This segmentation allows the majority of the leadframe structure and all semiconductor component connections to remain intact while only modifying a single lead portion to achieve package type conversion, thereby maintaining electrical connectivity while minimizing manufacturing cost
Data Source
AI summary
A semiconductor package includes at least one semiconductor device situated on a leadframe island, a first at least one lead protruding from a first side of the semiconductor package and configured to provide a first electrical connection to at least one terminal of the at least one semiconductor device, a second at least one lead protruding from a second side of the semiconductor package and configured to provide a second electrical connection to the at least one terminal of the at least one semiconductor device, and a continuous conductive structure configured to provide a conductive path between the first at least one lead, the second at least one lead, and the at least one terminal of the at least one semiconductor device through the leadframe island such that the at least one semiconductor device continues to function after trimming the first at least one lead.