Adaptable Printed Circuit Board Wiring for BGA Package Versatility
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Solution Overview
Problem
Conventional BGA packages face challenges in manufacturing printed circuit boards that can adapt to different types of semiconductor packages due to limited design flexibility, leading to increased costs and time for redesigning and manufacturing new boards for each package type.
Innovation Solution
A printed circuit board design featuring partially removed wiring patterns and selectively formed conductive members, such as ACF, ACI, or conductive polymer, between electrode terminals and ball lands, allowing for electrical connection or disconnection to accommodate various package types without requiring a new design, using a solder resist to expose or cover the conductive members as needed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional BGA packages use fixed wiring patterns for specific package types, then manufacturing precision is maintained, but adaptability to different package types is limited
Solution Approach 1:
The patent applies the dynamics principle by making the wiring pattern configurable rather than fixed. The wiring pattern can be dynamically adjusted based on the specific package type requirements, allowing the same PCB design to adapt to different BGA package configurations without requiring separate designs for each package type.
Solution Approach 2:
The patent implements universality by creating a single PCB design that can serve multiple package types. The configurable wiring pattern enables one PCB to perform the function of multiple specialized PCBs, reducing the need for separate designs for different package configurations.
2Adaptability or versatility
If printed circuit boards are redesigned for each package type, then adaptability is improved, but manufacturing time and costs increase
Solution Approach 1:
The patent applies preliminary action by pre-configuring the PCB with configurable wiring patterns that can be adjusted before manufacturing. This allows the PCB to be prepared in advance with the ability to adapt to different package types without requiring time-consuming redesigns after the manufacturing process begins.
Solution Approach 2:
The patent utilizes parameter changes by allowing the wiring pattern parameters (such as trace routing, connection points, and configuration settings) to be modified based on package type requirements. This enables adaptation through parameter adjustment rather than complete redesign, significantly reducing manufacturing time.
3Adaptability or versatility
If wiring patterns are completely removed and conductive members are formed, then adaptability to different connections is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies segmentation by dividing the wiring pattern into removable segments and conductive member formation zones. This allows selective removal of specific wiring pattern portions and precise formation of conductive members in designated areas, maintaining manufacturing precision while achieving connection flexibility.
Solution Approach 2:
The patent uses conductive members as intermediary elements between the PCB trace and the ball land. These conductive members can be selectively formed in specific regions to create adaptable electrical connections, serving as a mediator that provides flexibility while maintaining precise manufacturing through controlled formation processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables adaptation of a single printed circuit board to various package types without additional manufacturing time or costs, allowing for efficient electrical connections and reducing the need for frequent design changes.
Implementation Method 1
conductive members selectively formed in regions where the wiring patterns are partially removed
Data Source
AI summary
A printed circuit board having adaptable wiring lines includes an insulation layer. Electrode terminals and ball lands are formed on an upper surface of the insulation layer and are separated from each other. Wiring patterns are formed on the insulation layer, interposed between the electrode terminals and the ball lands, and partially removed in a region between the electrode terminals and the ball lands. Conductive members are selectively formed in the regions where the wiring patterns are partially removed to selectively connect the electrode terminals and the ball lands.