Semiconductor Test Adapter Board Real-Time Monitoring

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Solution Overview

Problem

Defective adapter boards in semiconductor chip test apparatuses reduce productivity and reliability, as they are difficult to access and monitor during testing.

Innovation Solution

A test apparatus with a motherboard, handler, and adapter boards equipped with sensors and a wireless transceiver that transmits real-time data about the adapter boards' conditions, allowing for timely detection of defects and environmental abnormalities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If adapter boards are used in semiconductor chip testing, then testing capability is provided, but productivity and reliability are reduced when adapter boards become defective

Engineering Contradiction:
Improvetesting reliabilityVSAvoidtesting productivity
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent applies preliminary action by monitoring adapter board conditions (temperature, humidity, bending, vibration) before defects occur. Sensors continuously collect data during storage and handling phases, allowing proactive identification of deteriorating conditions that could lead to defects, enabling preventive maintenance before testing productivity is impacted.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements feedback through real-time data collection from sensors on adapter boards, transmission via wireless communicators to centralized systems, and automated alerting when thresholds are exceeded. This closed-loop feedback mechanism enables continuous monitoring and rapid response to potential failures, maintaining both reliability and productivity.

Inventive Principle:
Principle #23Feedback

2Reliability

If real-time monitoring of adapter boards is implemented, then reliability is improved, but device complexity increases

Engineering Contradiction:
Improveadapter board reliabilityVSAvoidmonitoring system complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies universality by designing a multi-functional monitoring system where a single integrated platform handles multiple functions: temperature sensing, humidity sensing, bending detection, vibration monitoring, data wireless transmission, and centralized data analysis. This consolidates what would otherwise require separate systems into one unified solution, reducing overall complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent implements self-service by enabling adapter boards to autonomously monitor their own conditions through onboard sensors and communicators without requiring external intervention. The adapter boards self-diagnose and transmit their status automatically, reducing the need for complex external monitoring infrastructure and manual inspection processes.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves productivity and reliability by enabling real-time monitoring and detection of adapter board defects and environmental conditions, ensuring accurate testing of semiconductor chips.

Implementation Method 1

a first sensor mounted on the adapter board and senses data about temperature of the adapter board

Methodology Applied
Scientific EffectTemperature sensing:

Implementation Method 2

a wireless transceiver mounted on the adapter board and transmits, in real time, the sensed data

Methodology Applied
Scientific EffectWireless transmission:

Data Source

PatentUS11506740B2Test apparatus which tests semiconductor chips
Publication Date: 2022.11.22 SAMSUNG ELECTRONICS CO LTD
  • US11506740B2 patent drawing
  • US11506740B2 patent drawing
  • US11506740B2 patent drawing

AI summary

A test apparatus includes a motherboard including a first surface. The test apparatus further includes a handler including a second surface facing the first surface of the motherboard. The test apparatus additionally includes an adapter board disposed between the first surface of the motherboard and the second surface of the handler. The test apparatus further includes a first sensor mounted on the adapter board and senses data about temperature of the adapter board. The test apparatus additionally includes a wireless transceiver mounted on the adapter board and transmits, in real time, the sensed data.