Adapter With Flow Control For Liquid Cooling Loop
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In liquid cooling systems for computing equipment, inconsistent flow rate and pressure drop lead to inefficient cooling and increased costs, particularly in heterogeneous systems where customized connections are required, resulting in higher power expenditure and longer cooling times.
Innovation Solution
The introduction of adapters with flow control devices, such as valves and auxiliary pumps, that couple liquid cooling loop subassemblies to device rack manifolds, allowing for regulation of coolant flow rates and accommodating different connector configurations, thereby optimizing cooling efficiency across multiple computing systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling is implemented in heterogeneous computing systems, then cooling capability is provided, but flow rate and pressure drop become inconsistent throughout the system
Solution Approach 1:
The patent implements flow control devices at individual adapter locations to regulate coolant flow specifically for each computing system. This local control approach allows each subsystem to receive appropriate flow rates tailored to its specific cooling requirements, resolving the inconsistency caused by heterogeneous system configurations.
Solution Approach 2:
The patent introduces adjustable flow control devices that can dynamically regulate coolant flow rates. These devices enable adaptive control of flow distribution across different computing systems, allowing the system to optimize cooling performance for each component while maintaining overall system balance.
2Temperature
If customized manual connections are used for each computing system, then specific cooling requirements are met, but device complexity and installation time increase
Solution Approach 1:
The patent designs adapters with standardized connector configurations that can interface with multiple types of computing systems. These universal adapters eliminate the need for custom-manufactured connections for each system while maintaining the ability to meet specific cooling requirements through integrated flow control devices.
Solution Approach 2:
The adapter serves as an intermediary component between the manifold and individual computing systems. It provides a standardized interface that simplifies connections while incorporating flow control functionality, thereby reducing overall system complexity and installation effort.
3Productivity
If higher flow rates are used to improve cooling, then cooling efficiency increases, but power consumption increases
Solution Approach 1:
The patent uses locally-controlled flow regulation devices to optimize coolant flow rates for each computing system individually. This prevents unnecessary high flow rates in systems that do not require them, thereby reducing overall power consumption while maintaining adequate cooling efficiency where needed.
Solution Approach 2:
The patent implements adjustable flow control devices that can modify flow rate parameters to optimize the balance between cooling efficiency and power consumption. By dynamically adjusting flow rates based on actual cooling requirements, the system achieves efficient cooling while minimizing energy expenditure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances cooling efficiency by achieving a more uniform flow rate and pressure drop, reducing power consumption, and simplifying the integration of diverse cooling systems within a rack, thereby lowering operational costs and improving thermal management.
Implementation Method 1
The flow control device is disposed between the first and second connectors and is configured to regulate a flow rate of liquid coolant through the liquid cooling loop subassembly
Implementation Method 2
Liquid cooling can be used within computing equipment and on data center racks to aid in the reduction of heat generated by microelectronic elements with the chip assemblies, as well as heat generated by components external to the assembly
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
An adapter for coupling a liquid cooling loop subassembly of a computing system to a device rack manifold includes a main body, a first connector disposed on the main body, a second connector disposed on the main body, and a flow control device disposed between the first and second connectors. The first connector couples the adapter to a coupling of the liquid cooling loop subassembly. The second connector couples the adapter to the device rack manifold. The flow control device may be configured to regulate a flow rate of liquid coolant through the liquid cooling loop subassembly. The adapter may be further incorporated into a rack assembly or multi-rack assembly to achieve thermal management of multiple computing systems with cooling loop subassemblies.