Adapter Apparatus with Laminate-Mounted Conductive Elements
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Solution Overview
Problem
Conventional adapters for ball grid array packages face challenges such as high manufacturing costs due to tight dimensional control requirements and difficulties in reworking circuit boards with soldered packages, as well as the inability to reuse expensive packages after testing.
Innovation Solution
The use of laminate material to mount conductive elements within substrate openings, forming a fillet seal around the conductive elements to secure them in place and prevent solder migration, while allowing for easy access and reusability of the packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If press-fit terminals are used in substrate openings, then the adapter can be manufactured, but tight dimensional control is required which increases manufacturing cost
Solution Approach 1:
The patent changes the mounting method from mechanical press-fit to chemical bonding using epoxy material. This parameter change eliminates the need for tight dimensional control of hole sizes while maintaining secure terminal mounting, thereby reducing manufacturing cost without sacrificing precision requirements
Solution Approach 2:
The patent replaces the mechanical press-fit system with a chemical bonding system using epoxy. This substitution eliminates the need for precisely controlled hole dimensions required for press-fit, as the epoxy provides both mechanical support and electrical insulation, resolving the contradiction between ease of manufacture and manufacturing precision
2Reliability
If solder spheres are melted and fused to conductive pads, then the package is mounted securely, but the package cannot be reused after testing
Solution Approach 1:
The patent introduces an adapter as an intermediate component that segments the mounting system into three separate parts: the package, the adapter, and the circuit board. The package mounts to the adapter rather than directly to the board, allowing the package to be removed and reused while maintaining secure mounting through the adapter's socket interface
Solution Approach 2:
The adapter serves as an intermediary component between the package and the circuit board. It provides socket interfaces that receive the package's solder spheres, allowing secure mounting while enabling package removal and reuse. The adapter absorbs the permanent modification (solder melting) while preserving the package for future use
3Strength
If multiple hole sizes are formed for press-fit terminals, then the terminals are held securely, but the substrate requires tight dimensional control which increases manufacturing complexity
Solution Approach 1:
The patent changes the terminal mounting mechanism from mechanical interference fit to chemical bonding with epoxy. This allows uniform hole sizes to be used throughout the substrate while achieving secure terminal holding through the epoxy's adhesive strength and structural properties, thereby reducing substrate manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces manufacturing costs and facilitates the reuse of ball grid array packages by providing a secure and accessible mounting system for conductive elements, enhancing the efficiency and cost-effectiveness of package testing and rework processes.
Implementation Method 1
The laminate material is heated to a temperature sufficient to melt the laminate material
Implementation Method 2
the flowed and cured laminate material forms a seal about a perimeter of the conductive element and bridges a gap between the conductive element and one or more surfaces defining the opening
Data Source
AI summary
An adapter apparatus and methods for using in providing such adapter apparatus include providing a substrate having a plurality of openings defined therethrough. A plurality of conductive elements are mounted within corresponding openings thereof using a flowable and curable laminate material.