Adapter Module for Securing Heat Sink Without Substrate Holes
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Solution Overview
Problem
High-performance computer systems face challenges in securing microprocessors and heat sinks with precise positioning and efficient cooling while minimizing mechanical load variations and spatial interference, which complicates the layout and strength of printed circuit boards.
Innovation Solution
An integrated circuit module assembly that includes a substrate with a land grid array, a backing plate, and a frame with an adapter module that allows for direct thermal communication between a heat dissipation device and the microprocessor without adding holes to the substrate, using fasteners to secure the frame and backing plate, and an adapter module that secures the heat dissipation device outside the frame perimeter to extend inside for thermal communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of mounting holes in the substrate is increased to secure heat sinks and microprocessors, then the securing reliability is improved, but the substrate strength is reduced and circuit layout is interfered with
Solution Approach 1:
The patent moves the heat sink mounting function from the substrate plane to the adapter module plane. The adapter module serves as an intermediary carrier that holds the heat sink and positions it over the microprocessor, eliminating the need for additional substrate holes while maintaining secure attachment and thermal contact.
2Reliability
If the number of mounting holes in the substrate is increased to secure heat sinks and microprocessors, then the securing reliability is improved, but the circuit layout is interfered with
Solution Approach 1:
The patent relocates the heat sink mounting function to the adapter module, which operates in a different spatial plane than the substrate. This dimensional separation allows circuit traces and components on the substrate to be laid out without considering heat sink mounting hole requirements, significantly simplifying circuit layout design.
3Temperature
If the frame and adapter module are secured using additional fasteners and holes, then the thermal communication efficiency is improved, but the substrate strength and layout are compromised
Solution Approach 1:
The adapter module acts as an intermediary component between the frame and the heat sink. It provides dedicated mounting features for the heat sink while being attached to the frame, thereby enabling effective thermal coupling without requiring direct attachment of the heat sink to the substrate through additional holes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides flexible installation and design options for microprocessors and heat sinks, maintaining efficient thermal communication without compromising the strength or layout of the printed circuit board, while avoiding the need for additional fasteners or substrate holes.
Implementation Method 1
a heat dissipation device such as a heat sink is fastened to the adapter module outside the perimeter of the frame and extends inside the perimeter of the frame for direct thermal communication with the integrated circuit module
Data Source
AI summary
Adapter module securable to a socket frame, integrated circuit module assembly and method for securing a heat dissipation device in direct thermal communication with an integrated circuit module. The socket frame is positioned over a substrate having a land grid array and the frame is secured to the substrate. The frame defines a well for selectively receiving the integrated circuit module in electronic communication with the land grid array. The adapter module is secured to the frame and extends outside the perimeter of the frame. The adapter provides a feature outside the perimeter of the frame for fastening the heat dissipation device. Furthermore, the adapter body is secured to the frame without adding holes through the substrate, such as by extending under the frame to be secured between the frame and substrate, or by extending over the frame to be secured between the frame and fasteners.