Adapter Plate for Single Chip Wafer Probing
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Solution Overview
Problem
Existing wafer probing systems are not efficiently designed to test single chips, as they require specialized equipment and struggle with thermal contact and chip alignment.
Innovation Solution
A method and device using an adapter plate with a cutout to accommodate a single chip, which is mounted on a vacuum chuck, allowing for precise positioning and electrical testing within a standard wafer probing system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a standard wafer probing system is used to test single chips, then the system can handle complete wafers efficiently, but it cannot effectively test single chips due to poor thermal contact and alignment issues
Solution Approach 1:
An adapter plate is introduced as an intermediary component between the vacuum chuck and the single chip. The adapter plate has a wafer-like outer shape that interfaces with the vacuum chuck system, while containing a cutout that accommodates the single chip. This mediator enables the wafer probing system to handle single chips by providing proper mechanical support, thermal contact through the plate, and alignment features, while the chip itself only needs to contact the probes for electrical testing
Solution Approach 2:
The adapter plate is segmented into distinct functional zones: an outer wafer-like portion that interfaces with the vacuum chuck and positioning system, and an inner cutout region that accommodates the single chip. This segmentation allows the system to treat the single chip as if it were part of a complete wafer, enabling use of existing wafer handling infrastructure while focusing thermal and mechanical resources on the specific chip being tested
2Reliability
If specialized equipment is used to test single chips, then thermal contact and alignment can be improved, but the device complexity and cost increase
Solution Approach 1:
The adapter plate serves multiple functions simultaneously: it provides mechanical support for the single chip, establishes thermal contact through its body, enables vacuum holding via its wafer-like outer shape, provides alignment features for the probing system, and interfaces with the existing vacuum chuck and positioning mechanisms. This multi-functionality allows a standard wafer probing system to test single chips without requiring specialized equipment modifications
Solution Approach 2:
The adapter plate is designed to copy or mimic the essential characteristics of a complete semiconductor wafer, particularly its outer shape and interface features. By replicating the wafer-like form factor and interface geometry, the adapter plate can be handled by existing wafer processing equipment, allowing single chip testing using standard tooling without requiring new specialized equipment
3Productivity
If the adapter plate is designed to accommodate multiple chips, then productivity increases, but the positioning and alignment complexity increases
Solution Approach 1:
When multiple chips are accommodated on a single adapter plate, each chip is placed in its own designated cutout or mounting region. The positioning system determines the exact location of each chip by reading its identification data and calculating the specific coordinates within the search area. This segmentation approach allows multiple chips to be tested on one adapter plate while maintaining individual positioning accuracy through software-based coordinate management rather than physical alignment complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient testing of single chips by improving thermal contact and alignment, allowing for seamless integration into standard test flows and supporting multiple chip testing without interfering with existing tool handling or automated test algorithms.
Implementation Method 1
a vacuum chuck onto which the adapter plate gets loaded
Implementation Method 2
contacting the at least one single chip electrically with probes of the wafer probing system
Data Source
AI summary
A method for testing at least one single chip in a wafer probing system, at least comprising: providing an adapter plate having an interface surface for contacting a vacuum chuck of the wafer probing system, the adapter plate being configured to accommodate the at least one single chip in a cutout with a chip rear surface being flush with the interface surface; loading the adapter plate with the at least one single chip into the wafer probing system; determining an exact position of the at least one single chip in the adapter plate in the search area; and testing the at least one single chip with test routines stored in a controller of the wafer probing system. A device and an adapter plate for testing at least one single chip in a wafer probing system.