Adapter Plate for Turbo Pump Mounting in Semiconductor Modules
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Solution Overview
Problem
In semiconductor processing systems, the failure of a turbo pump attached directly to a process module using a poppet valve makes it difficult to remove the pump due to bent bolts, potentially damaging the module and complicating servicing.
Innovation Solution
An adapter plate is introduced between the turbo pump and the process module, allowing the turbo pump to be mounted on the adapter plate, which can be easily removed from the module, protecting the module from damage and facilitating servicing by using stronger bolts for attaching the adapter plate to the module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the turbo pump is attached directly to the process module using bolts, then the pump can be securely mounted to maintain vacuum, but the bolts may bend during pump failure making removal difficult and potentially damaging the module
Solution Approach 1:
The system is divided into three separate components: the process module, the adapter plate, and the turbo pump. The adapter plate acts as an intermediate segment that couples the pump to the module, allowing the pump to be removed by detaching it from the adapter plate without affecting the module or requiring removal of bolts from the module itself.
Solution Approach 2:
The adapter plate serves as an intermediary component between the turbo pump and the process module. It provides a mounting interface for the pump using separate bolts that are not attached to the module, thereby mediating the connection and protecting the module from damage during pump removal.
2Strength
If stronger bolts are used to secure the pump to the module, then the pump attachment becomes more reliable, but the module structure may be compromised or damaged during installation or failure
Solution Approach 1:
The attachment system is segmented into two separate bolt sets: one set securing the pump to the adapter plate, and another set securing the adapter plate to the module. This segmentation allows each bolt set to be optimized independently, with the first set using stronger bolts without compromising the module structure.
Solution Approach 2:
The adapter plate acts as an intermediary that absorbs the mechanical stress and strong attachment requirements, protecting the process module from the harmful effects of strong bolts. The module only needs to support the adapter plate, not the full pump assembly, reducing the risk of damage.
3Device complexity
If the pump is directly mounted to the module, then the structure is simpler, but servicing requires complex disassembly and may damage the module
Solution Approach 1:
The mounting structure is segmented into modular components (process module, adapter plate, pump) with standardized interfaces. This segmentation maintains overall structural simplicity while enabling easy servicing through sequential disassembly of the pump from the adapter plate without disturbing the module.
Solution Approach 2:
The system transitions from a static direct-mount configuration to a dynamic multi-level assembly where the pump can be independently mounted and removed from the adapter plate. This dynamic arrangement facilitates maintenance while preserving the permanent module structure.
Data Source
AI summary
A system comprises a process module, a pump, and an adapter plate. The process module processes a semiconductor substrate, has an opening at a lower end, and includes a poppet valve above the opening. The pump operates in conjunction with the poppet valve to evacuate gases from the process module. The adapter plate is arranged above the pump and below the opening at the lower end of the process module. The adapter plate includes an inner cavity coincident with the opening and an outer perimeter smaller than the lower end of the process module. The adapter plate includes a first set of bores arranged around the inner cavity and a second set of bores arranged along the outer perimeter. First fasteners fasten the pump to the adapter plate through the first set of bores. Second fasteners fasten the adapter plate to the process module through the second set of bores.