Adaptive Camera Parameter Control for Semiconductor 3D Reconstruction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional wafer inspection systems (WIS) struggle to capture images that effectively contribute to accurate 3D reconstruction of features on semiconductor substrates, often resulting in incomplete or low-quality reconstructions due to fixed camera settings and inefficient image capture methods.
Innovation Solution
The system and method dynamically adjust camera parameters such as illumination intensity, off-axis illumination shape, and focus height to optimize image capture, filter images for quality, and determine when sufficient images are obtained for accurate 3D reconstruction, using a controller to automate these adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a predetermined number of images are captured at predetermined locations using fixed camera settings, then the inspection process is simple to operate, but the 3D reconstruction quality is insufficient and incomplete
Solution Approach 1:
The system dynamically adjusts camera parameters (illumination intensity, off-axis illumination shape, focus height) during the image capture process based on real-time analysis of captured images, transitioning from static predetermined settings to adaptive dynamic control to optimize 3D reconstruction quality
Solution Approach 2:
The system analyzes captured images to determine whether camera parameters should be adjusted, creating a feedback loop where reconstruction quality assessment drives parameter optimization for subsequent image capture cycles
2Reliability
If fixed camera settings are used for image capture, then the operation is simple and fast, but the images do not capture the feature well and do not add useful information to the 3D reconstruction
Solution Approach 1:
The system performs preliminary analysis of initially captured images to determine optimal camera parameters before proceeding with additional image capture, ensuring that subsequent images are captured with optimized settings that maximize useful information content
Solution Approach 2:
The system dynamically adapts camera parameters based on feature characteristics detected in preliminary images, adjusting illumination, focus, and other settings to optimize image quality specifically for the features being inspected
3Measurement precision
If manual parameter adjustment is performed to optimize image capture, then the 3D reconstruction accuracy improves, but the inspection throughput decreases due to manual intervention time
Solution Approach 1:
The system automatically analyzes captured images and self-adjusts camera parameters without manual intervention, enabling the inspection system to optimize its own operation and maintain high throughput while achieving improved reconstruction accuracy
Solution Approach 2:
The system implements automated feedback control where image analysis results directly drive parameter adjustment decisions, eliminating manual intervention while maintaining optimization of reconstruction quality
Data Source
AI summary
Embodiments of systems and methods are disclosed for inspecting features formed within and/or on a semiconductor substrate. More specifically, the present disclosure provides various embodiments of systems and methods to automatically adjust one or more parameters (or camera settings) used by a camera system to capture a stack of images of a feature formed within and/or on a semiconductor substrate before the images are processed to generate a three-dimensional (3D) reconstruction of the feature. In some embodiments, the disclosed systems and methods may filter the images included within the stack of images used for 3D reconstruction and dynamically determine when the camera system has captured enough images for 3D reconstruction of the feature. In doing so, the disclosed systems and methods may provide a more complete and accurate 3D reconstruction of the feature, while improving throughput of the wafer inspection process.