Adaptive Discharge Control for Uniform Bevel Cutting on Non-Uniform Substrates
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Solution Overview
Problem
In semiconductor device manufacturing, bevel cutting processing on substrates with non-uniform peripheral surfaces results in inconsistent cutting widths due to variations in the landing position of processing liquids, leading to irregular film removal.
Innovation Solution
A substrate processing apparatus and method that includes a rotating/holding unit, a processing liquid discharging unit, a variation acquiring unit, and a discharge controller to adjust the discharge angle and position of the processing liquid based on the deformation variations of the substrate's peripheral portion, ensuring uniform cutting width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the processing liquid is discharged in an inclined direction onto the peripheral portion of the substrate having non-uniform surface positions, then the processing can be performed, but the landing position of the processing liquid on the peripheral portion becomes non-uniform, and the cutting width in the bevel cutting processing is not regular
Solution Approach 1:
The discharge angle of the processing liquid is dynamically adjusted based on the measured surface position variations. The discharge angle varies corresponding to different angular positions around the substrate periphery, allowing the processing liquid to land at consistent radial positions despite surface non-uniformities. This dynamic adjustment resolves the contradiction by making the discharge system adaptive rather than static.
Solution Approach 2:
The system measures the actual surface positions of the peripheral portion and uses this information to control the discharge angle. This feedback mechanism ensures that the processing liquid compensates for surface variations, maintaining uniform cutting width. The feedback loop connects surface measurement to discharge parameter adjustment, resolving the precision issue.
2Manufacturing precision
If the discharge angle of the processing liquid is adjusted based on surface position variations, then the cutting width uniformity is improved, but the device complexity increases due to additional control mechanisms
Solution Approach 1:
The discharge control system serves multiple functions: it controls the discharge angle based on surface measurements, coordinates with the substrate rotation, and maintains overall processing precision. By making the discharge system multi-functional, the patent reduces the need for separate dedicated components for each function, thereby managing complexity while achieving precision.
Solution Approach 2:
The system changes the discharge angle parameter dynamically based on measured surface conditions rather than using fixed geometric arrangements. This parameter-based control approach is more flexible and integrated than adding mechanical adjustment mechanisms, reducing structural complexity while achieving the desired precision through software/control logic.
3Device complexity
If the processing liquid is discharged at a fixed angle, then the device complexity is reduced, but the landing position varies on substrates with non-uniform surfaces, resulting in irregular cutting width
Solution Approach 1:
Rather than using a fixed discharge angle, the system dynamically adjusts the discharge angle based on real-time surface measurements. This dynamic approach maintains precision without requiring complex mechanical adjustment mechanisms, as the control is achieved through coordinated parameter changes rather than physical reconfiguration.
Solution Approach 2:
The system uses feedback from surface position measurements to control the discharge angle. This feedback mechanism allows the simple fixed-angle discharge structure to be effectively compensated through control logic, maintaining precision without adding complex mechanical components. The feedback loop enables the simple structure to achieve high precision through intelligent control.
Data Source
AI summary
A substrate processing apparatus 1 is configured to supply a processing liquid to a peripheral portion of a wafer W being rotated. The substrate processing apparatus 1 includes a rotating/holding unit 21 configured to rotate and hold the wafer W; a processing liquid discharging unit 73 configured to discharge the processing liquid toward the peripheral portion of the wafer W held by the rotating/holding unit 21; a variation acquiring unit configured to acquire information upon a variation amount of a deformation of the peripheral portion of the wafer W; and a discharge controller 7 configured to control a discharge angle and a discharge position of the processing liquid from the processing liquid discharging unit 73 onto the peripheral portion based on the information upon the variation amount of the deformation of the peripheral portion acquired by the variation acquiring unit.