Temperature-Adaptive Gate Drive for Oscillation and Switching Loss

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Solution Overview

Problem

Existing semiconductor drive devices face a trade-off between preventing gate oscillation and switching loss, as methods to suppress gate oscillation, such as using capacitors or increasing gate resistance, often result in increased switching loss due to reduced switching speed.

Innovation Solution

A semiconductor drive device with a drive circuit, a passive element connected to the gate of the semiconductor switching element, a switching element in series with the passive element, and a control circuit that adjusts the switching element's operation based on temperature to prevent gate current and oscillation, thereby balancing gate oscillation prevention and switching loss.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a capacitor is disposed between the gate and source or gate resistance is increased to prevent gate oscillation, then gate oscillation is suppressed, but switching speed is reduced and switching loss increases

Engineering Contradiction:
Improvegate oscillationVSAvoidswitching loss
Core Design Contradiction:
Object-affected harmful factorsVSLoss of energy

Solution Approach 1:

The patent applies dynamics by making the gate resistance variable rather than fixed. The gate resistance is dynamically adjusted based on the switching state: during normal switching operations it maintains a low value to enable fast switching, while during voltage oscillation events it increases to suppress oscillations. This dynamic adaptation resolves the contradiction between fast switching (low resistance) and oscillation suppression (high resistance).

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the parameter of gate resistance from a static value to a variable value that can be adjusted in real-time. By controlling the gate resistance to switch between different resistance levels based on operating conditions, the system optimizes both switching performance and oscillation suppression, resolving the trade-off between switching speed and gate oscillation prevention.

Inventive Principle:
Principle #35Parameter changes

2Object-affected harmful factors

If gate resistance is increased to prevent gate oscillation, then gate current is prevented and oscillation is suppressed, but switching speed is reduced

Engineering Contradiction:
Improvegate oscillationVSAvoidswitching speed
Core Design Contradiction:
Object-affected harmful factorsVSSpeed

Solution Approach 1:

The gate resistance is made dynamic, switching between low and high values based on real-time detection of oscillation conditions. During normal operation, low resistance enables fast switching speed. When oscillation is detected, resistance increases to suppress oscillations. This dynamic behavior resolves the contradiction between maintaining high switching speed and suppressing gate oscillation.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent implements feedback by detecting voltage oscillations at the gate and using this information to control the gate resistance. The detection circuit monitors for oscillation conditions, and based on this feedback, the control circuit adjusts the gate resistance accordingly. This closed-loop feedback mechanism enables the system to maintain optimal switching speed while suppressing oscillations when they occur.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The device effectively prevents gate oscillation while minimizing switching loss by dynamically controlling the passive element's function based on temperature, optimizing performance across varying temperature conditions.

Implementation Method 1

a capacitor is disposed between the gate and the source of the semiconductor switching element

Methodology Applied
Scientific EffectCapacitance: Capacitance

Implementation Method 2

This vibration phenomenon is caused by parasitic capacitance of the semiconductor switching element and parasitic inductance of wiring

Methodology Applied
Scientific EffectParasitic capacitance: Parasitic Capacitance

Implementation Method 3

The control circuit controls the switching element such that when the temperature detected by the temperature detection circuit is high, the gate current is prevented more than when the temperature is low

Methodology Applied
Scientific EffectTemperature-dependent conductivity: Electrical Resistance

Data Source

PatentUS12081115B2Semiconductor drive device, semiconductor device, and power conversion device
Publication Date: 2024.09.03 MITSUBISHI ELECTRIC CORP
  • US12081115B2 patent drawing
  • US12081115B2 patent drawing
  • US12081115B2 patent drawing

AI summary

A semiconductor drive device includes a drive circuit that drives a semiconductor switching element, a passive element connected to a gate of the semiconductor switching element to prevent a gate current of the semiconductor switching element, a switching element connected in series to the passive element, a control circuit that controls the switching element, and a temperature detection circuit that detects a temperature of the semiconductor switching element. The control circuit controls the switching element such that when the temperature detected by the temperature detection circuit is high, the gate current is prevented more than when the temperature is low.