Adaptive Heat Dissipation Frame With Selective Thermal Coupling
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Solution Overview
Problem
The thinness of modern mobile devices hampers effective heat dissipation due to limited space for heat sinks, leading to heat accumulation and reduced efficiency.
Innovation Solution
A heat-conducting system with selectively engageable gates between heat-dissipating elements, controlled by a thermal management system based on temperature readings, to manage heat flow and maintain optimal operating temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the device is made thinner to improve portability, then ease of carrying is improved, but heat dissipation capability deteriorates due to limited space for heat sinks
Solution Approach 1:
The heat dissipation system is segmented into multiple independent heat-dissipating elements (first heat-dissipating element coupled to processing unit, second heat-dissipating element coupled to touch-sensitive display surface) that can be selectively connected. This segmentation allows the system to distribute heat management across multiple zones without increasing overall device thickness, as each element operates independently or in combination based on thermal needs.
Solution Approach 2:
The patent implements a dynamic heat dissipation system where a heat-conducting element can be selectively coupled between the first and second heat-dissipating elements based on temperature readings. This dynamic reconfiguration allows the system to adapt heat flow paths in real-time, optimizing thermal management for different operating conditions without requiring a fixed, bulky heat sink structure.
2Productivity
If processing capabilities are increased to improve performance, then productivity is improved, but heat generation increases leading to heat accumulation
Solution Approach 1:
The heat-conducting element serves as an intermediary between the first and second heat-dissipating elements. When processing capabilities are increased and heat generation rises, this intermediary component can be selectively engaged to transfer heat from the processing unit area to the touch-sensitive display surface area, effectively mediating heat distribution without requiring additional active cooling components that would increase device thickness.
Solution Approach 2:
The system changes thermal parameters dynamically by selectively coupling heat-conducting elements based on temperature readings. When processing capabilities are increased and generate more heat, the system detects temperature changes and reconfigures the thermal pathways by engaging appropriate heat-conducting elements, thereby adapting the heat dissipation parameters to match the increased processing load.
3Temperature
If heat sinks are enlarged to improve heat dissipation, then temperature control is improved, but device thickness increases reducing portability
Solution Approach 1:
The touch-sensitive display surface serves a dual function: it is both the user interface and a heat-dissipating element. By coupling the second heat-dissipating element to the touch-sensitive display surface, the system utilizes an existing component for multiple purposes (display and thermal management), thereby improving heat dissipation efficiency without adding separate heat sink structures that would increase device thickness.
Solution Approach 2:
The patent merges the heat dissipation function with the existing display structure by coupling the second heat-dissipating element to the touch-sensitive display surface. This consolidation allows the display assembly to serve both its primary function and thermal management function, eliminating the need for separate, space-consuming heat sink components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively dissipates heat by dynamically adjusting heat conduction paths, preventing overheating and maintaining device performance and user safety.
Implementation Method 1
a heat-conducting element selectively coupled between the first heat-dissipating element and the second heat-dissipating element, the heat-conducting element can be positioned to allow or restrict heat to flow between the first heat-dissipating element and second dissipating element
Implementation Method 2
a first heat-dissipating element coupled to the processing unit, a second heat-dissipating element coupled to the touch-sensitive display surface
Data Source
AI summary
This document relates to providing a thermal management system for a device. One example determines temperature readings associated with one or more components of the device, and comparing the temperature readings to optimal operating temperatures. This example can selectively couple or decouple heat-dissipating elements based at least on the temperature readings associated with the one or more components of the device in order to reach the optimal operating temperatures.