Adaptive Heat Spreader Plungers for IC Die Thermal Contact
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Solution Overview
Problem
Conventional chip packaging schemes face challenges in providing adequate thermal management, leading to diminished service life and device failure due to high heat loads, and require unique custom designs for each chip package, increasing development costs and time.
Innovation Solution
A micro device with a heat spreader featuring a plurality of plungers that provide conductive heat paths, allowing for efficient heat transfer from irregular surface topographies, enabling a single heat spreader design to accommodate various chip packages without the need for custom designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional chip packaging schemes use custom-designed thermal management devices for each chip package, then thermal management effectiveness is improved, but device complexity and development time increase
Solution Approach 1:
The heat spreader is designed with a standardized interface and geometry that can accommodate multiple different chip package types. By using a universal heat spreader design with adjustable plungers, the same thermal management device can serve multiple chip packages with varying topographies, eliminating the need for custom designs for each chip package while maintaining effective thermal management.
Solution Approach 2:
The plunger mechanism incorporates movable, adjustable elements that can be positioned at different locations and depths to adapt to varying chip package topographies. This dynamic adjustability allows a single heat spreader design to accommodate different chip package configurations without requiring custom-designed thermal management devices for each application.
2Reliability
If conventional chip packaging schemes use custom-designed thermal management devices for each chip package, then thermal management effectiveness is improved, but development time and costs increase
Solution Approach 1:
The standardized heat spreader design with adjustable plungers serves as a universal solution that can be applied across multiple chip package iterations and designs. This universality significantly reduces development time by eliminating the need to design, validate, and manufacture custom thermal management devices for each new chip package, while still providing effective thermal management.
3Ease of manufacture
If heat spreader uses fixed geometry design, then manufacturing simplicity is improved, but adaptability to varying chip package topographies deteriorates
Solution Approach 1:
The heat spreader is segmented into a fixed base structure and movable plunger elements. The fixed base provides manufacturing simplicity and structural stability, while the segmented plunger elements can be independently adjusted to adapt to varying chip package topographies. This segmentation allows the heat spreader to combine manufacturing ease with adaptability.
Solution Approach 2:
The plunger elements are designed to be movable and adjustable within the heat spreader structure, transforming a static fixed-geometry design into a dynamic system. This dynamic capability allows the heat spreader to adapt to different chip package topographies while maintaining a relatively simple manufacturing process for the base structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides flexible thermal management, reducing design and development time, costs, and enabling higher power usage and improved performance by allowing the heat spreader to adapt to different chip package topographies with interchangeable heat transfer elements.
Implementation Method 1
a plurality of plungers extend from a bottom surface of the heat spreader... providing conductive heat paths
Implementation Method 2
A plurality of spring biased plungers extend from a bottom surface of the heat spreader
Data Source
AI summary
Micro devices having enhanced through heat transfer utilizing plungers extending from a heat spreader are provided. In one example, a micro device is provided that includes a plunger retaining block, a plurality of plungers, a mounting substrate and an integrated circuit (IC) die. The plunger retaining block includes a top surface and a bottom surface. The plurality of plungers extend from the bottom surface of the plunger retaining block with at least some of the plurality of plungers contacting the IC die. The IC die is disposed between the plunger retaining block and the mounting substrate, and coupled to the mounting substrate.