Adaptive IHS Cooling System for Processor Power Optimization
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Solution Overview
Problem
Conventional information handling system (IHS) component cooling systems are inefficient as they consume more power due to high fan usage at high ambient temperatures, outweighing the power saved by processor cooling, especially as processor power leakage increases with temperature.
Innovation Solution
An adaptive IHS component cooling system that includes a fan controller and storage device with target temperature settings for different ambient conditions, optimizing fan operation to balance processor power leakage and fan power consumption by adjusting fan speeds based on ambient temperature and thermal design power.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If fan speed is increased to cool the processor at high ambient temperatures, then processor temperature is reduced, but fan power consumption increases at a cubic rate
Solution Approach 1:
The system dynamically adjusts the processor target temperature based on ambient temperature conditions. At high ambient temperatures, the processor is allowed to operate at higher temperatures rather than maintaining a constant offset temperature, thereby reducing fan speed and the cubic power consumption associated with high-speed fan operation.
Solution Approach 2:
The invention changes the target temperature parameter of the processor from a fixed constant offset to a variable value that depends on ambient temperature. This parameter change allows the system to optimize the balance between processor temperature control and fan power consumption across different operating conditions.
2Use of energy by moving object
If fan speed is reduced to minimize fan power consumption, then fan energy use decreases, but processor temperature increases leading to higher processor power leakage
Solution Approach 1:
The system dynamically adjusts the processor target temperature based on ambient temperature conditions. At low ambient temperatures, the processor is cooled to a lower target temperature (constant offset) to minimize power leakage, while at high ambient temperatures, the target temperature is raised to reduce fan power consumption.
Solution Approach 2:
The invention changes the target temperature parameter of the processor from a fixed constant offset to a variable value that depends on ambient temperature. This parameter change allows the system to optimize the balance between processor temperature control and fan power consumption across different operating conditions.
3Reliability
If constant offset temperature cooling is applied, then processor temperature is controlled consistently, but total system power consumption increases at high ambient temperatures
Solution Approach 1:
The system transitions from static constant offset temperature control to dynamic temperature control that adapts to ambient conditions. The fan controller adjusts the processor target temperature based on real-time ambient temperature sensing, optimizing total system power consumption across different operating environments.
Solution Approach 2:
The system uses feedback from ambient temperature sensing to dynamically adjust the processor target temperature. The fan controller receives ambient temperature input and modifies the cooling strategy accordingly, creating a closed-loop control system that optimizes total power consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system minimizes total power consumption by dynamically adjusting component target temperatures according to ambient conditions, reducing inefficiencies in cooling at high temperatures and achieving significant power savings compared to traditional constant offset cooling methods.
Implementation Method 1
at least one fan in fluid communication with the IHS component
Implementation Method 2
operate the at least one fan in order to reduce the temperature of the IHS component
Data Source
AI summary
An IHS includes an IHS chassis. A processor is located in the IHS chassis. At least one fan is located in the IHS chassis and in fluid communication with the processor. A temperature sensor is located in the IHS chassis. A fan controller is coupled to the processor, the at least one fan, the temperature sensor, and a storage device that includes a plurality of processor target temperatures that are each associated with a different ambient temperature. The fan controller is operable to receive a first ambient temperature from the temperature sensor, determine a first processor target temperature that is associated with the first ambient temperature, receive a temperature of the processor, and operate the at least one fan in order to reduce the temperature of the processor to the first processor target temperature.


