Adaptive Interconnect Structure for Bond Pad Offset Compensation
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving precise bonding between integrated circuit dies due to lateral offsets of bond pads, leading to poor electrical coupling and incomplete bonding, which is exacerbated by misalignment and process variations.
Innovation Solution
An adaptive interconnect structure is formed using programmable photolithography techniques to connect offset bond pads to corrected pads with minimal or no offset, enabling more precise bonding without requiring significant process changes or additional steps, by determining patterns based on historical data or real-time measurements to compensate for lateral offsets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional photolithography with fixed photomasks is used, then manufacturing process is simple, but bonding precision deteriorates due to lateral offsets of bond pads
Solution Approach 1:
The patent applies dynamics by replacing fixed photomasks with a programmable photolithography system that can dynamically adjust exposure patterns. The system determines lateral offsets and generates customized exposure patterns for each die, enabling adaptive correction of bond pad positions without physical mask changes. This dynamic approach transforms the static photolithography process into a flexible, data-driven process that achieves high bonding precision.
Solution Approach 2:
The patent changes the parameter of photolithography from fixed pattern exposure to variable pattern exposure based on measured lateral offsets. By modifying the exposure pattern parameters according to actual die positions and bond pad offsets, the system achieves precise alignment. This parameter change enables the manufacturing process to adapt to variations in die placement and bond pad positioning.
2Reliability
If lateral offsets of bond pads are not compensated, then manufacturing process is fast, but electrical coupling quality deteriorates
Solution Approach 1:
The patent applies preliminary action by measuring lateral offsets and determining corrected exposure patterns before the actual bonding process. The system performs offset measurement, pattern generation, and photolithography exposure in advance, creating a complete correction plan before bonding occurs. This preliminary preparation ensures high electrical coupling quality without adding significant time during the critical bonding step itself.
Solution Approach 2:
The patent uses copying by creating a digital representation of the required exposure pattern based on measured lateral offsets. The system generates a corrected pattern that copies the ideal bond pad alignment, compensating for actual deviations. This digital copying approach allows rapid pattern generation and adjustment without physical mask fabrication, maintaining manufacturing speed while improving coupling quality.
3Manufacturing precision
If photomasks are used for pattern correction, then alignment precision improves, but manufacturing cost increases
Solution Approach 1:
The patent replaces the mechanical photomask system with a programmable photolithography system. Instead of using physical masks that require fabrication, storage, and alignment, the system uses software-generated exposure patterns projected directly onto the photoresist. This substitution eliminates mask-related costs while maintaining or improving alignment precision through digital pattern control.
Solution Approach 2:
The patent replaces expensive, reusable photomasks with disposable digital patterns. Each exposure pattern is generated as needed based on measured offsets, eliminating the need for costly mask fabrication and replacement. The digital patterns can be modified and regenerated at minimal cost, making the process economically viable for high-precision bonding correction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves bonding quality and electrical coupling, enhances device reliability and yield, and allows for flexible manufacturing adjustments without the need for costly photomasks, effectively addressing misalignment and process errors.
Implementation Method 1
An adaptive interconnect structure is formed using programmable photolithography techniques to connect offset bond pads to corrected pads with minimal or no offset
Data Source
AI summary
A package includes a first package component including a semiconductor die, wherein the semiconductor die includes conductive pads, wherein the semiconductor die is surrounded by an encapsulant; an adaptive interconnect structure on the semiconductor die, wherein the adaptive interconnect structure includes conductive lines, wherein each conductive line physically and electrically contacts a respective conductive pad; and first bond pads, wherein each first bond pad physically and electrically contacts a respective conductive line; and a second package component including an interconnect structure, wherein the interconnect structure includes second bond pads, wherein each second bond pad is directly bonded to a respective first bond pad, wherein each second bond pad is laterally offset from a corresponding conductive pad which is electrically coupled to that second bond pad.