Memory Chip Temperature Control Through Adaptive Payload Limits

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Solution Overview

Problem

As critical dimensions of devices in integrated circuits shrink, 3D NAND memory devices face challenges in managing temperature fluctuations that can impact operations and cause damage, particularly when power consumption leads to elevated temperatures.

Innovation Solution

A method for controlling the total payload of a memory device by measuring current temperature and adjusting operations based on predefined temperature ranges, using a temperature range-current total payload relation to prevent overheating, and implementing a timer to manage operation frequency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the memory device operates continuously with high payload to maximize productivity, then productivity is improved, but temperature rises causing damage and operational instability

Engineering Contradiction:
Improvememory device throughputVSAvoidmemory device temperature
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The patent implements periodic temperature measurements and payload adjustments by introducing a timer that triggers temperature checks at predefined time intervals. The controller periodically modifies the total payload based on current temperature readings, creating a cyclical control pattern that prevents continuous overheating while maintaining high productivity during cooler periods.

Inventive Principle:
Principle #19Periodic action

Solution Approach 2:

The patent establishes a feedback loop where the controller continuously monitors temperature through temperature measurements, compares current temperature against previously recorded temperatures, and adjusts the total payload accordingly. This closed-loop control system uses temperature feedback to dynamically modify operational parameters, ensuring productivity is maximized within safe temperature boundaries.

Inventive Principle:
Principle #23Feedback

2Stability of the object's composition

If the controller frequently measures temperature and adjusts payload to maintain stable temperature, then temperature stability is improved, but operation complexity increases

Engineering Contradiction:
Improvetemperature stabilityVSAvoidcontrol system complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent introduces dynamic payload adjustment by modifying the total payload based on current temperature conditions rather than using a fixed payload. The controller dynamically calculates the remaining payload by subtracting operation-specific payload requirements from the temperature-adjusted total payload, enabling adaptive temperature control that responds to real-time thermal conditions without requiring complex control algorithms.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the operational parameter (total payload) based on temperature conditions by establishing a relationship between temperature ranges and corresponding total payload values. The controller selects appropriate total payload values from predefined ranges based on current temperature measurements, simplifying the control logic while achieving effective temperature stability through parameter adaptation.

Inventive Principle:
Principle #35Parameter changes

3Speed

If the memory device operates at high payload to meet data transfer demands, then data transfer speed is improved, but temperature fluctuations increase causing operational failures

Engineering Contradiction:
Improvedata transfer speedVSAvoidoperation reliability
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The patent performs preliminary temperature measurements and payload adjustments before executing data transfer operations. The controller proactively monitors temperature trends and adjusts the total payload in advance based on predicted thermal conditions, preventing temperature-related failures before they occur while maintaining high data transfer speeds during favorable thermal conditions.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS20250279123A1Method for controlling temperature of chips and related chips
Publication Date: 2025.09.04 YANGTZE MEMORY TECH CO LTD
  • US20250279123A1 patent drawing
  • US20250279123A1 patent drawing
  • US20250279123A1 patent drawing

AI summary

A memory system includes a memory device, a temperature sensor configured to measure a temperature of the memory device, and a memory controller coupled to the memory device and the temperature sensor. The memory controller is configured to obtain a current temperature of the memory device, control the memory device to perform one or more operations, and based on the current temperature and a payload relating to a power of the one or more operations, suspend transferring of data between the memory device and the memory controller.