Memory Chip Temperature Control Through Adaptive Payload Limits
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Solution Overview
Problem
As critical dimensions of devices in integrated circuits shrink, 3D NAND memory devices face challenges in managing temperature fluctuations that can impact operations and cause damage, particularly when power consumption leads to elevated temperatures.
Innovation Solution
A method for controlling the total payload of a memory device by measuring current temperature and adjusting operations based on predefined temperature ranges, using a temperature range-current total payload relation to prevent overheating, and implementing a timer to manage operation frequency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the memory device operates continuously with high payload to maximize productivity, then productivity is improved, but temperature rises causing damage and operational instability
Solution Approach 1:
The patent implements periodic temperature measurements and payload adjustments by introducing a timer that triggers temperature checks at predefined time intervals. The controller periodically modifies the total payload based on current temperature readings, creating a cyclical control pattern that prevents continuous overheating while maintaining high productivity during cooler periods.
Solution Approach 2:
The patent establishes a feedback loop where the controller continuously monitors temperature through temperature measurements, compares current temperature against previously recorded temperatures, and adjusts the total payload accordingly. This closed-loop control system uses temperature feedback to dynamically modify operational parameters, ensuring productivity is maximized within safe temperature boundaries.
2Stability of the object's composition
If the controller frequently measures temperature and adjusts payload to maintain stable temperature, then temperature stability is improved, but operation complexity increases
Solution Approach 1:
The patent introduces dynamic payload adjustment by modifying the total payload based on current temperature conditions rather than using a fixed payload. The controller dynamically calculates the remaining payload by subtracting operation-specific payload requirements from the temperature-adjusted total payload, enabling adaptive temperature control that responds to real-time thermal conditions without requiring complex control algorithms.
Solution Approach 2:
The patent changes the operational parameter (total payload) based on temperature conditions by establishing a relationship between temperature ranges and corresponding total payload values. The controller selects appropriate total payload values from predefined ranges based on current temperature measurements, simplifying the control logic while achieving effective temperature stability through parameter adaptation.
3Speed
If the memory device operates at high payload to meet data transfer demands, then data transfer speed is improved, but temperature fluctuations increase causing operational failures
Solution Approach 1:
The patent performs preliminary temperature measurements and payload adjustments before executing data transfer operations. The controller proactively monitors temperature trends and adjusts the total payload in advance based on predicted thermal conditions, preventing temperature-related failures before they occur while maintaining high data transfer speeds during favorable thermal conditions.
Data Source
AI summary
A memory system includes a memory device, a temperature sensor configured to measure a temperature of the memory device, and a memory controller coupled to the memory device and the temperature sensor. The memory controller is configured to obtain a current temperature of the memory device, control the memory device to perform one or more operations, and based on the current temperature and a payload relating to a power of the one or more operations, suspend transferring of data between the memory device and the memory controller.


