Adaptive Electronic Component Mounting Position Correction
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Solution Overview
Problem
Existing electronic component mounting systems face challenges in achieving uniform joint quality due to varying self-alignment effects based on component shape, size, and solder characteristics, leading to potential joint defects when using a single position correction method for all components.
Innovation Solution
An electronic component mounting system that includes a printing device, positional-shift amount calculation, and multiple mounting modes for each electronic component device, allowing for position correction based on calculated shifts or referencing the electrode position alone, tailored to specific component characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single position correction method based on solder printing position is uniformly employed for all electronic components, then the mounting process is simplified and productivity is improved, but joint quality deteriorates due to insufficient self-alignment effect for certain component types
Solution Approach 1:
The system dynamically selects between two mounting position correction methods based on component characteristics. For components where self-alignment effect is effective (small components), the system uses solder printing position as reference. For components where self-alignment is insufficient (large components), the system switches to using electrode position as reference, thereby adapting the correction method to component-specific requirements while maintaining overall productivity
Solution Approach 2:
The invention changes the reference parameter for mounting position correction based on component type. Instead of uniformly using solder printing position, the system switches between two reference parameters: solder printing position for small components and electrode position for large components. This parameter change ensures appropriate self-alignment effect for each component type while maintaining manufacturing efficiency
2Manufacturing precision
If position correction is applied for all components regardless of type, then mounting precision may be improved for some components, but joint defects occur for other component types due to inappropriate correction
Solution Approach 1:
The system applies different mounting position correction strategies to different component types based on their local characteristics. Small components receive correction based on solder printing position to maximize self-alignment effect, while large components receive correction based on electrode position where self-alignment is insufficient. This localized quality approach ensures appropriate precision for each component type without causing joint defects
Solution Approach 2:
The mounting control portion dynamically determines the appropriate correction method by evaluating component characteristics. The system switches between two correction approaches: using solder printing position as reference when self-alignment is effective, and using electrode position as reference when self-alignment is insufficient. This dynamic adaptation prevents joint defects while maintaining mounting precision
3Device complexity
If the self-alignment effect is relied upon for all component types, then the mounting process becomes simpler, but the effect is insufficient for large-sized components with large mass
Solution Approach 1:
The invention segments the mounting process into two distinct correction approaches based on component characteristics. For small components, the system uses solder printing position as reference and relies on self-alignment effect. For large components, the system uses electrode position as reference and does not rely on self-alignment. This segmentation allows the process to maintain simplicity where applicable while ensuring precision where needed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise mounting position correction, improving joint quality by adapting to different component types and sizes, reducing defects and enhancing the self-alignment effect during the reflow process.
Implementation Method 1
a suction force due to the surface tension is not sufficient to move the electronic component
Data Source
AI summary
An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information—when component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of a printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component mounting device.