Adaptive Multifocal Exposure Processing for Substrate Flatness

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Solution Overview

Problem

Existing exposure processes for large substrates with high flatness lead to increased processing time and decreased productivity due to the need for multifocal exposure, which involves multiple focal positions, causing pattern distortion and reduced efficiency.

Innovation Solution

A method for determining exposure processing that includes obtaining flatness data, deriving evaluation values based on this data, and deciding whether to perform multifocal exposure at multiple focus positions on the substrate, optimizing the exposure process to maintain high productivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If multifocal exposure is performed to handle large flatness, then pattern distortion is prevented, but exposure processing time increases and productivity decreases

Engineering Contradiction:
Improvepattern shape accuracyVSAvoidexposure processing speed
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent applies parameter changes by dynamically adjusting the number of focal positions based on the measured flatness value. When flatness is within the depth of focus, single-focus exposure is used; when flatness exceeds the depth of focus, multifocal exposure is activated. This adaptive parameter adjustment resolves the contradiction by applying complex exposure only when necessary, maintaining both pattern accuracy and productivity.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent implements dynamics through the dynamic determination of exposure methodology based on real-time flatness measurement. The system transitions between single-focus and multifocal exposure modes according to the substrate's actual flatness conditions, creating a dynamic exposure process that adapts to varying manufacturing conditions rather than using a fixed approach.

Inventive Principle:
Principle #15Dynamics

2Productivity

If substrate diameter is enlarged to improve productivity, then manufacturing throughput increases, but substrate flatness increases causing exposure difficulties

Engineering Contradiction:
Improvemanufacturing throughputVSAvoidsurface flatness
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies dynamics by implementing a dynamic exposure adjustment system that responds to measured flatness variations. The system automatically determines whether single-focus or multifocal exposure is needed based on the actual flatness measurement, allowing the use of large-diameter substrates while maintaining exposure quality through adaptive focus adjustment.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent uses parameter changes by modifying the exposure process parameters (number of focal positions) based on the flatness measurement results. This allows the system to accommodate larger substrates with greater flatness variations by adjusting the exposure parameters rather than rejecting the substrates, thereby maintaining both productivity and precision.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enhances productivity by optimizing exposure processes for substrates with large flatness, reducing processing time while minimizing pattern distortion and maintaining high throughput.

Implementation Method 1

a projection optical system that projects an image of a pattern onto the substrate

Methodology Applied
Scientific EffectFocusing: Focusing

Implementation Method 2

when the flatness is larger than the depth of focus, distortion occurs in the pattern shape to be transferred

Methodology Applied
Scientific EffectDepth of Field: Depth of Field

Data Source

PatentUS20250264811A1Exposure process determination method, exposure apparatus, exposure method, article manufacturing method, and computer-readable storage medium
Publication Date: 2025.08.21 CANON KK
  • US20250264811A1 patent drawing
  • US20250264811A1 patent drawing
  • US20250264811A1 patent drawing

AI summary

An exposure process determination method of projecting an image of a pattern of an original onto a substrate and exposing the substrate according to the present invention, includes: a flatness obtaining step of obtaining a flatness in an exposure region of the substrate; an evaluation value deriving step of deriving an evaluation value based on the flatness; and a determining step of determining whether to perform multifocal exposure in which exposure processing is performed a plurality of times at a plurality of focus positions on the exposure region of the substrate based on the evaluation value.