Adaptive Surface Correction for Electronic Device Assembly
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Solution Overview
Problem
In electronic device manufacturing, mounting surfaces that are not within specified tolerances can lead to issues such as light leakage and improper assembly, causing yield fallout and inefficiencies, due to protrusions, burrs, or uneven surfaces.
Innovation Solution
A method involving scanning to determine surface profiles, using an automated optical inspection system to detect deviations, and applying a material to correct the surfaces, either by removal or addition, to ensure co-planarity and adherence to tolerances before assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If automated optical inspection and adaptive material application are implemented, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The system performs preliminary scanning and surface profile determination before assembly, identifying deviations from target profiles in advance. Material is then adaptively applied to correct these deviations before the parts are assembled, preventing assembly issues rather than correcting them afterward.
Solution Approach 2:
An adhesive or material layer is introduced as an intermediary between two parts with non-matching surfaces. This material compensates for surface profile deviations, allowing parts to achieve proper alignment and co-planarity despite initial tolerances being exceeded.
2Productivity
If scanning and material correction processes are added, then productivity is improved through reduced yield fallout, but loss of time increases due to additional processing steps
Solution Approach 1:
Surface scanning and material correction are performed preliminarily before assembly operations. By correcting surface deviations early, the system prevents assembly failures and rework, improving overall productivity despite the added processing time.
Solution Approach 2:
The system uses automated scanning and adaptive material application to self-correct surface profile deviations without requiring manual intervention or complex post-assembly adjustments, reducing the need for rework and improving effective yield.
Data Source
AI summary
A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structured such that the two structures may be, for example, adhesively bonded together. The localized corrective actions are configured not to improve the mating surface but to also prevent light within the electronic device from escaping in undesired areas of the electronic device. In some embodiments, the corrective action includes using a removal tool to remove identified portions of the surface. In other embodiments, the corrective action includes using a different tool to add material identified portions of the surface. The identified means may include an automated inspection system.